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Polyurethane grinding pad and manufacturing method thereof

A polishing pad and polyurethane technology, applied in the polishing field, can solve the problems of difficulty in meeting the integration of integrated circuits, affecting polishing efficiency, scratching the polishing surface, etc., and achieving stable polishing effect, improving polishing efficiency, and reducing scratches.

Active Publication Date: 2018-06-08
HUBEI DINGHUI MICROELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to distribute the polishing liquid evenly in the polishing area and ensure a more uniform polishing process, grooves of various shapes are usually set on the surface of the polishing layer. However, various surface grooves will also retain various waste materials such as polishing debris and polishing layer fragments. , especially when the groove is set in the circumferential direction or the groove is deep, it is difficult to discharge the waste accumulated in the groove in time, which not only affects the polishing efficiency, but also may scratch the polished surface, and it is difficult to meet the increasingly high integration level of integrated circuits. , Global planarization requirements with smaller and smaller feature sizes

Method used

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  • Polyurethane grinding pad and manufacturing method thereof
  • Polyurethane grinding pad and manufacturing method thereof
  • Polyurethane grinding pad and manufacturing method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0043] see figure 1 Shown, a kind of polyurethane polishing pad, comprises the polishing layer 1 obtained by reacting the prepolymer of isocyanate termination, curing agent composition and hollow microsphere, wherein, the amino group in the curing agent composition and unreacted NCO in the prepolymer The molar ratio is 85:100, the average pore size of the polishing layer is 10 μm, and the number of micropores on the surface is 200 / mm 2 , with a roughness of 5 μm. The surface of the polishing layer 1 is provided with a first groove 2 with a concentric circle pattern centered on the center of the polishing layer 1. The cross section of the first groove 2 is rectangular, and the bottom of the first groove 2 has a lubricating coating 4 , wherein, lubricating coating 4 is fluorine-containing polyol, fluorine-containing polyol comprises aliphatic fluorine-containing polyol, aliphatic fluorine-containing polyol contains 6 carbon atoms, and aliphatic fluorine-containing polyol is a mo...

Embodiment 2

[0045] see figure 1 Shown, a kind of polyurethane polishing pad, comprises the polishing layer 1 obtained by reacting the prepolymer of isocyanate termination, curing agent composition and hollow microsphere, wherein, the amino group in the curing agent composition and unreacted NCO in the prepolymer The molar ratio is 95:100, the average pore diameter of the polishing layer is 80 μm, and the number of micropores on the surface is 800 / mm 2 , the roughness is 15 μ m, the surface of the polishing layer 1 is provided with the first groove 2 of the concentric circle pattern with the center of the polishing layer 1 as the center, the cross section of the first groove 2 is rectangular, and the bottom of the first groove 2 has a lubricating coating Layer 4, wherein the lubricating coating 4 is a fluorine-containing polyol, the fluorine-containing polyol includes an aliphatic fluorine-containing polyol, the aliphatic fluorine-containing polyol contains 14 carbon atoms, and the aliphat...

Embodiment 3

[0047] see figure 1 Shown, a kind of polyurethane polishing pad, comprises the polishing layer 1 obtained by reacting the prepolymer of isocyanate termination, curing agent composition and hollow microsphere, wherein, the amino group in the curing agent composition and unreacted NCO in the prepolymer The molar ratio is 90:100, the average pore diameter of the polishing layer is 50 μm, and the number of micropores on the surface is 500 / mm 2 , the roughness is 10 μ m, the surface of the polishing layer 1 is provided with the first groove 2 of the concentric circle pattern with the center of the polishing layer 1 as the center, the cross section of the first groove 2 is rectangular, and the bottom of the first groove 2 has a lubricating coating Layer 4, wherein the lubricating coating 4 is a fluorine-containing polyol, the fluorine-containing polyol includes an aliphatic fluorine-containing polyol, the aliphatic fluorine-containing polyol contains 10 carbon atoms, and the aliphat...

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Abstract

The invention discloses a polyurethane grinding pad and a manufacturing method thereof, and relates to the technical field of polishing. The polyurethane grinding pad comprises a polishing layer obtained through a reaction of an isocyanate end-capped prepolymer, a curing agent composition and a microballoon sphere, wherein the molar ratio of amidogen in the curing agent composition to unreacted NCO in the prepolymer is 85:100-95:100, the average aperture of the polishing layer is 10-80 micrometers, the number of micropores in the surface of the polishing layer is 200-800 / mm<2>, the roughness is 5-15 micrometers, grooves are formed in the surface of the polishing layer, the bottoms of the grooves are provided with lubricating coatings which are fluorine-containingpolyhydric alcohols, and the grooves include a first groove which is in a concentric circle pattern with the center of the polishing layer as the circle center.The lubricating coatings are arranged at the bottoms of the grooves, which facilitates flow of a polishing solution at the bottoms of the grooves and makes waste materials discharged along with the polishing solution more easily and not remain in the grooves, therefore scratches are reduced, and the polishing effect is more stable.

Description

technical field [0001] The invention relates to the technical field of polishing, in particular to a polyurethane polishing pad and a manufacturing method thereof. Background technique [0002] Chemical mechanical polishing (CMP) provides surface planarization in the VLSI manufacturing process, organically combines the mechanical grinding effect of abrasive grains with the chemical action of oxidants, and can achieve ultra-precision non-damaging surface processing. As a key component of the CMP process, the abrasive pad should have the following functions: store the polishing liquid and transport it to the entire processing area to make the processing surface evenly polished; take away the residual substances in the polishing process from the processing surface, such as polishing Debris, polishing layer fragments, etc.; transfer and carry the unloading load required during machining removal; maintain the mechanical and chemical environment required during machining. In orde...

Claims

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Application Information

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IPC IPC(8): B24B37/24
CPCB24B37/24
Inventor 朱顺全吴晓茜张季平车丽媛
Owner HUBEI DINGHUI MICROELECTRONICS MATERIALS CO LTD
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