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A kind of snpbbisb series low temperature reinforced solder and preparation method thereof

A bi-sb, solder technology, applied in the field of low-temperature brazing solder and its preparation, can solve the problems of low melting point of alloy, reliability of PCB deformation, etc.

Active Publication Date: 2021-06-01
BEIJING COMPO ADVANCED TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a new type of SnPbBiSb-X solder alloy for low-temperature brazing of PET flexible sheets in the LED industry. The alloy has a low melting point and can fundamentally solve the problem of high soldering temperature. The resulting PCB deformation and poor reliability after soldering

Method used

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  • A kind of snpbbisb series low temperature reinforced solder and preparation method thereof
  • A kind of snpbbisb series low temperature reinforced solder and preparation method thereof
  • A kind of snpbbisb series low temperature reinforced solder and preparation method thereof

Examples

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Effect test

Embodiment 1

[0044] A SnPbBiSb series low-temperature enhanced solder alloy, in weight percentage, the solder alloy contains: Pb 39%, Bi 13%, Sb 2.5%, the rest is Sn, and the melting point of the solder alloy is 129-163.4°C. The method for preparing the solder alloy comprises the following steps:

[0045] 1) Add metal Bi and Sb with a purity of 99.99wt.% into the vacuum melting furnace at an alloy ratio of 80:20 by weight, and vacuumize to 1×10 -1 Pa, filled with nitrogen; heat the alloy to 650-700 ° C to melt, and at the same time, add electromagnetic stirring to make the alloy composition uniform, and then vacuum cast to prepare the Bi-Sb20 master alloy;

[0046] 2) The prepared Bi-Sb master alloy and metals Sn and Pb are melted in a melting furnace according to the alloy ratio. Cover the surface of the alloy with an anti-oxidation solvent. The anti-oxidation solvent can be selected from rosin or KCl-LiCl molten salt. Heat the alloy to 250°C and keep it warm for 10 minutes to remove the...

Embodiment 2

[0048] A SnPbBiSb series low temperature reinforced solder alloy, in weight percentage, the solder alloy contains: Pb 46%, Bi 18.1%, Sb 1.24%, the rest is Sn, the melting point of the solder alloy is 129.5-162.8°C. The method for preparing the solder alloy is the same as that in Example 1 except that the alloy ratio is different.

Embodiment 3

[0050] A kind of SnPbBiSb series low-temperature strengthened solder alloy, the solder alloy contains: Pb 35.6%, Bi 8.1%, Sb 0.001%, Ce 0.003%, Al 0.03%, Ag 0.5%, and the rest is Sn by weight percentage. The melting point of the alloy is 126.8-165.5°C. The method for preparing the solder alloy comprises the following steps:

[0051] 1) Add metal Bi and Sb with a purity of 99.99wt.% into the vacuum melting furnace at an alloy ratio of 80:20 by weight, and vacuumize to 1×10 -2 Pa, filled with nitrogen, heated to 650-700 ° C to melt, and at the same time, electromagnetically stirred to make the alloy composition uniform, and then vacuum cast to prepare a Bi-Sb20 master alloy;

[0052] 2) Add metals Sn and Ce, Sn and Al, Sn and Ag with a purity of 99.99wt.% into the vacuum melting furnace according to a certain alloy ratio, and vacuumize to 1×10 -2 Pa, after being filled with nitrogen; the alloys were heated to 690-780°C, 650-700°C, and 350-450°C to melt, and electromagnetic sti...

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Abstract

The invention relates to a SnPbBiSb series low-temperature reinforced solder and a preparation method. The solder is used for low-temperature soldering of PET flexible sheets in the LED industry. ‑52.4%, Bi 3.1‑23.2%, Sb 0.001‑5.0%; optionally X component, wherein X contains one or more elements selected from Ce, Al, Ti, Co, V, In and Ag Alloying elements, the rest are Sn and a small amount of inevitable impurities. The solder alloy of the invention has uniform structure, small crystal grains, low melting point, excellent mechanical properties and solder joint reliability, and low solder cost, and is suitable for LED product soldering and low-temperature soft solder fields of PET flexible PCB sheets.

Description

technical field [0001] The invention relates to the technical field of low-temperature solder, in particular to a low-temperature solder used for PET flexible plates in the LED industry and a preparation method thereof. Background technique [0002] The development of PCB board technology has made new breakthroughs in recent years. In the preparation process of traditional metal hard PCB boards, it is necessary to use chemical etching circuits and then go through pickling, water washing and other processes. The use of chemicals and water caused by cleaning Issues such as pollution and energy waste cannot be underestimated. At present, with the breakthrough of flexible sheet technology in the LED lighting industry, the new PET flexible PCB sheet effectively solves the problems existing in the traditional PCB sheet preparation process. The PET flexible LED sheet is prepared by physical cutting method. Using the unique pure copper circuit design and the PET material with bette...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26B23K35/14B23K35/40
CPCB23K35/0222B23K35/268B23K35/40
Inventor 贺会军刘希学朱捷王志刚温余苗安宁张江松祝志华赵朝辉张富文李晓强李宏华
Owner BEIJING COMPO ADVANCED TECH
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