Manufacturing method for large-size seamless micro-nano soft mold

A manufacturing method and soft mold technology, which is applied in the field of manufacturing, can solve the problems such as the inability to realize the soft mold manufacturing of large-size non-splicing and accepting scale molds, and achieve the effects of low manufacturing cost, no splicing errors, and high precision

Active Publication Date: 2018-06-15
QINGDAO TECHNOLOGICAL UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the manufacture of large-scale micro-nano molds (mother molds), especially large-scale splice-free micro-nano soft molds, is a challenging problem faced by current large-area nanoimprinting and large-area micro-nano patterning technologies.
Existing micro-nano manufacturing technologies such as electron beam lithography, focused ion beam manufacturing, and interference lithography face many shortcomings and limitations in the realization of large-scale jointless micro-nano mold manufacturing, such as processing cost, manufacturing cycle, and maximum patterning area. etc., especially the existing technology is almost impossible to realize the manufacture of large-scale non-splicing sub-scale molds (mother molds) and soft molds of more than 8 inches, which has become a restriction for the current large-area nanoimprinting and micro-nano patterning. Wide industrial application Biggest technical bottleneck

Method used

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  • Manufacturing method for large-size seamless micro-nano soft mold

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] The present embodiment is used for the making of large-scale non-splicing composite soft mold, such as figure 1 As shown, the specific preparation steps are as follows:

[0044] (1) Substrate 1 pretreatment: A1 performs anti-adhesion treatment on glass substrate 1 to form anti-adhesion layer 2

[0045]Glass is used as the substrate 1, and the surface of the glass substrate 1 is subjected to anti-adhesion treatment. Firstly, the glass substrate 1 is cleaned, and deionized water is ultrasonically treated for 10 minutes; isopropanol is ultrasonically treated for 20 minutes; (FDTS), let it stand for 15 minutes; then, put the glass substrate 1 into it and soak for 30 minutes; then use isooctane, acetone, and isopropanol to clean each under ultrasonic conditions for 20 minutes; make the surface of the substrate 1 form an anti-adhesion layer 2 , and finally blow dry with nitrogen.

[0046] (2) Fabrication of sacrificial structure 3 by hot-melt electrohydrodynamic jet printi...

Embodiment 2

[0062] The specific preparation steps for the production of large-size non-splicing soft molds in this embodiment are as follows:

[0063] (1) Substrate 1 pretreatment

[0064] Glass is used as the substrate 1, and the surface of the glass substrate 1 is subjected to anti-adhesion treatment. Firstly, the glass substrate 1 is cleaned, and deionized water is ultrasonically treated for 10 minutes; isopropanol is ultrasonically treated for 20 minutes; (FDTS), let it stand for 15 minutes; then, put the glass substrate 1 into it and soak for 30 minutes; then use isooctane, acetone, and isopropanol to clean each under ultrasonic conditions for 20 minutes; make the surface of the substrate 1 form an anti-adhesion layer 2. Finally, blow dry with nitrogen.

[0065] (2) Fabrication of sacrificial structures by thermal fusion electrohydrodynamic jet printing 3

[0066] Using polycaprolactone (PCL) as the electrojet printing material, according to the micro-nano mold pattern structure t...

Embodiment 3

[0077] The specific preparation steps for the production of large-size non-splicing soft molds in this embodiment are as follows:

[0078] (1) Substrate 1 pretreatment

[0079] Glass is used as the substrate 1, and the surface of the glass substrate 1 is subjected to anti-adhesion treatment. Firstly, the glass substrate 1 is cleaned, and deionized water is ultrasonically treated for 10 minutes; isopropanol is ultrasonically treated for 20 minutes; (FDTS), let it stand for 15 minutes; then, put the glass substrate 1 into it and soak for 30 minutes; then use isooctane, acetone, and isopropanol to clean each under ultrasonic conditions for 20 minutes; make the surface of the substrate 1 form an anti-adhesion layer 2 , and finally blow dry with nitrogen.

[0080] (2) Fabrication of sacrificial structures by thermal fusion electrohydrodynamic jet printing 3

[0081] Using polycaprolactone (PCL) as the electrojet printing material, according to the micro-nano mold pattern structu...

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Abstract

The invention discloses manufacturing method for a large-size seamless micro-nano soft mold. The manufacturing method comprises the following steps that 1, a base plate is pretreated; 2, power jet printing on a hot melt electric fluid to manufacture a sacrificial structure, and according to pattern structure of the micro-nano mold to be manufactured, the sacrificial structure which is opposite tothe mold is manufactured; 3, graph replication and transfer are carried out, wherein a spin coating or pouring process is adopted, liquid soft mold material uniformly coats on the sacrificial structure, and the liquid soft mold material is pre-cured; 4, demolding is carried out, wherein a combination body of a soft mold and the printed sacrificial structure is completed separated from the base plate so as to obtain the composite soft die; and 5, post-treatment is carried out on the composite soft mold. According to the manufacturing method, the technical advantages of power jet printing on thehot melt electric fluid and a casting replication transfer process are combined, so that manufacturing of the large-size seamless micro-nano soft mold is realized, and the manufacturing method particularly has the unique advantage that the rapid and low-cost manufacturing of the meter-scale seamless micro-nano composite soft mold can be achieved.

Description

technical field [0001] The invention relates to a manufacturing method, more specifically to a manufacturing method of a large-size non-splicing micro-nano soft mold. Background technique [0002] In order to improve and improve the performance and quality of products in the fields of high-definition flat panel display, high-efficiency solar panels, anti-reflection and self-cleaning glass, LED patterning, and wafer-level micro-nano optical devices, there is a huge need for large-area micro-nano patterning technology. The common feature of these products is the need to manufacture large-area complex three-dimensional micro-nano structures efficiently and at low cost on large-scale non-flat rigid substrates (hard substrates or substrates) or fragile substrates. Large-size OLED, LCD, photovoltaic solar panels and other fields also have huge industrial demand for ultra-fine conductive patterns such as transparent electrodes. Nanoimprinting provides a solution with industrial ap...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C69/00B29C64/106B29C39/02B29C41/08B33Y10/00G03F7/00
CPCB29C39/02B29C41/08B29C69/00B33Y10/00G03F7/0002
Inventor 兰红波许权赵佳伟周贺飞
Owner QINGDAO TECHNOLOGICAL UNIVERSITY
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