Series composite structure double-frequency multi-amplitude piezoelectric ultrasonic transducer

Abstract

The invention discloses a series composite structure double-frequency and multi-amplitude piezoelectric ultrasonic transducer applied to a thermal ultrasonic wire bonding and sealing process of an integrated circuit chip. The transducer is composed of two sets of double-ended radiating piezoelectric oscillators and two two-stage mechanical variable-amplitude poles with different amplification factors. The transducer can work at the frequency near the frequency of 60 kHz or 120 kHz and has three driving modes. Under simple harmonic excitation signals with the same frequency, the transducer canobtain multiple amplitude outputs to meet the different requirements of the wire bonding process of the integrated circuit chip and improve the bonding connection efficiency and reliability. Meanwhile, clamping mechanisms of the composite structure ultrasonic transducer adopt flexible flange clamping mechanisms formed by circular arc hinges, the influence of the clamping rack disturbance torque onthe ultrasonic transmission efficiency in the axial ultrasonic transmission process of the variable-amplitude pole can be effectively lowered, and the utilization rate of ultrasonic energy is increased.

Description

technical field [0001] The invention belongs to the field of high-frequency ultrasonic precision manufacturing, and relates to a serial composite structure dual-frequency multi-amplitude piezoelectric ultrasonic transducer applicable to integrated circuit (IC) chip thermosonic wire bonding or flip-chip bonding sealing technology. Background technique [0002] With the development of integrated circuit (IC) chips towards high integration, multi-leads, and fine pitch, higher requirements are put forward for the connection efficiency and reliability of electrical leads between IC chip pads and package pins. Wire bonding Or flip-chip bonding equipment needs to be continuously developed to meet the requirements of various new semiconductor processes, new materials, and new connection reliability and efficiency. At present, wire bonding and flip-chip bonding technologies are dominant in the chip sealing process due to their simple process, low cost, and applicable to various packa...

AI Technical Summary

Problems solved by technology

Traditional piezoelectric ultrasonic transducers mostly work at a single frequency. The applicable power range is small and the amplitude selectivity is poor. When encountering the continuous processing requirements of different chip packages, the piezoelectric transducer needs to be replaced frequently to meet the requirements of the specific bonding process. The required frequency, power, amplitude, vibration speed and other requirements not only greatly reduce the work efficiency, but also make equipment debugging and process adjustment time-consuming and labor-intensive.

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