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An angle-adjustable array microhole laser processing method

A laser processing method and laser technology, applied in metal processing equipment, laser welding equipment, manufacturing tools, etc., can solve complex steps, unfavorable mass production of aperture array micro-holes, difficulty in meeting the requirements of micro-hole processing with large depth-to-diameter ratio, etc. problems, to achieve the effect of improving processing efficiency, improving processing accuracy, and ensuring processing accuracy

Active Publication Date: 2021-05-07
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the material of each layer of the processed PCB changes or the thickness changes, it is often necessary to re-test, which is not suitable for actual production and application, and it is also difficult to meet the processing requirements of micro-holes with a large depth-to-diameter ratio.
Patent CN201710028825.8 discloses a high-speed PCB manufacturing method and PCB, which can well realize the processing of micro-holes with a large depth-to-diameter ratio in PCBs, but the steps are complicated, and it is necessary to open copper windows before laser micro-hole processing. Copper treatment, after the micro-hole processing is completed, many follow-up operations including mechanical drilling are required, which is not conducive to the reduction of the hole diameter on the PCB and the mass production of the micro-hole array

Method used

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  • An angle-adjustable array microhole laser processing method
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  • An angle-adjustable array microhole laser processing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Such as figure 1 and 2 As shown, a laser 1 emits a laser beam 2, which passes through a mirror 3 to a focusing module 4, and the focused laser beam 2 processes a board 5 placed on an ultra-precision platform 6, and the board 5 is a multilayer PCB. The multi-layer PCB mainly includes a copper clad laminate 51 , a resin layer 52 and an adhesive layer 53 . First, measure the ablation threshold of each layer of the multi-layer PCB5, and determine the output power required for the laser beam 2 microhole processing according to the depth of the laser beam 2 microhole processing, and the output power of the laser beam 2 required for each layer is P1, P2 . Next, operations such as clamping of the workpiece and focusing of the laser beam 2 are carried out. Since this series of steps are familiar to those skilled in the art, details are not repeated here. Set the output power of the laser beam 2 to P1 again, process the copper clad laminate 51 on the top layer, set the process...

Embodiment 2

[0034] Measure the ablation threshold of each layer of the processed plate 5; fix the processed plate 5 on the ultra-precision platform 6; use parameters such as wavelength 355nm, pulse width 50ns, power 20W, repetition frequency 100kHz, defocus amount 0, etc. The laser beam 2 is used for micro-hole processing, and the scanning speed is 700mm / s. During the processing, according to the change of the micro-hole processing depth of the laser beam 2 and the ablation threshold of different materials, the output power of the laser beam 2 can range from 0 to 100W. Adjustments are made to suit different processing requirements.

[0035] Such as image 3 As shown, the plate 5 forms a positive taper hole at a certain angle after being processed by the laser beam 2 . At this time, set the output angle of the laser 2 to 2° through the focusing module 4 (adjust the output angle of the laser 2 to -5° to +5° according to actual needs) and adjust the focus position, and output the laser 2 to...

Embodiment 3

[0037] Determination of the ablation threshold of each layer material of the plate 5; fix the plate 5 on the ultra-precision platform 6; use the laser beam 2 with the parameters of wavelength 532nm, pulse width 80ns, power 30W, repetition frequency 100kHz, defocus amount 0, etc. For hole processing, the scanning speed is 800mm / s. During the processing, according to the change of the micro-hole processing depth of the laser beam 2 and the ablation threshold of different materials, the output power of the laser beam 2 can be adjusted within the range of 0-100W to adapt to Different processing requirements.

[0038] Such as Figure 4 As shown, the hole on the plate 5 will form a certain positive cone angle. At this time, the output angle and output power of the laser beam 2 are kept constant, and the rotation angle of the precision platform is adjusted to 30° along the y-axis direction (over The rotation angle of the precision platform 6 is 0-45°), the ultra-precision platform 6...

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Abstract

The invention provides an angle-adjustable array microhole laser processing method, which includes the following steps: S1: testing the ablation threshold of each layer of material in the plate; S2: fixing the plate on a precision platform; S3: according to the laser microhole The change of processing depth and the ablation threshold of different materials, adjust the laser output power, and perform micro-hole processing; S4: Set the laser output angle through the focus module or adjust the inclination angle of the plate hole through the ultra-precision platform, and re-adjust the focus position. According to the depth change of laser microhole processing and the ablation threshold of different materials, the laser output power is adjusted, and the holes are reprocessed to meet the processing requirements of cylindricity; this method is suitable for array microhole processing with high depth-to-diameter ratio, and has high Processing accuracy and processing efficiency.

Description

technical field [0001] The invention relates to the processing of plates, in particular to an angle-adjustable array microhole laser processing method. Background technique [0002] With the development of electronic technology, hole processing presents a trend of miniaturization and high-density integration. According to the hole size, hole processing mainly adopts mechanical drilling, chemical erosion and laser drilling. When the aperture is larger than 100 μm, machining is often used; when the aperture is <100 μm, laser processing has a huge advantage. [0003] Laser is a high-energy beam processing method, which can complete processing without contact with the workpiece. It has been widely used in micro-hole processing of various plate materials. At present, for laser microhole processing, the usual measure is to seek suitable laser processing parameters to realize the processing of cylindrical holes in plates. For example, the literature reports the method of proc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/382B23K26/70B23K26/046
CPCB23K26/046B23K26/382B23K26/702
Inventor 王成勇唐梓敏郑李娟王宏建黄欣杜策之胡小月
Owner GUANGDONG UNIV OF TECH
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