Preparation method of high-thermal-conductivity graphene floor heating floor

Abstract

The invention relates to a preparation method of a high-thermal-conductivity graphene floor heating floor. The method comprises the following steps of 1 single plate pretreating, 2 air drying at roomtemperature, 3 plasma treating, 4 dipping, 5 drying, 6 single plate blank matching and 7 hot pressing. According to the preparation method, a graphene-metal composite material is dissolved into a dipping solution, dipping modification is conducted on wood, the graphene-metal composite material is evenly distributed in wood cell cavities, therefore, the thermal conductivity of the wood can be greatly improved, and the density and the stability of the wood can be enhanced. The modified wood is made into the high-thermal-conductivity graphene floor heating floor by being taken as a veneer layer,a middle layer and a substrate, the thermal conductivity of the floor is effectively improved, and the functions of saving energy and reducing consumption and being uniform in thermal dissipation, stable in structure and the like of the floor heating floor are achieved.

Description

technical field [0001] The invention belongs to the technical field of wood-based panels, and in particular relates to a preparation method of a floor heating floor, in particular to a preparation method of a graphene high thermal conductivity floor heating floor. Background technique [0002] With the gradual improvement of people's demand for heating functionality and comfort in winter, floor heating floors are gradually becoming well-known and accepted by the public in my country, and the heating forms are constantly being innovated. At present, the research and development of underfloor heating floors focus on the anti-deformation ability and heat-generating layer materials and structures, while ignoring the heat conduction ability of the floor itself. It usually takes a lot of energy and time to slowly heat up the floor and indoor space. The thermal conductivity of wood is low, generally 0.04-0.12W / (m·K), and it is not easy to dissipate heat or conduct heat. Due to the...

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Problems solved by technology

Due to the lack of good thermal conductivity of wood in the floor heating floor on the market, there are common problems in the industry such as long heating time, uneven temperature distribution, and unstable heat transfer.

In order to improve the heat conduction performance of the floor, related domestic enterprises set up a metal heat conduction layer structure in the middle of the multi-layer solid wood floor, which not only increases the thickness, weight and cost of the floor, but also affects the texture of the floor

[0003] Graphene itself has good thermal conductivity, and its unique two-dimensional crystal structure endows graphene with a large specific surface area. In the prior art,...