Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A kind of low dielectric constant polyimide porous film and preparation method thereof

A technology of polyimide film and low dielectric constant, which is applied in the field of low dielectric constant polyimide porous film and its preparation, can solve the problems of complex operation process, expensive raw materials, cumbersome technology, etc., and achieve simplified film production The effect of steps, cheap raw materials, simple operation process and technology

Active Publication Date: 2020-09-15
HARBIN UNIV OF SCI & TECH
View PDF12 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a kind of simple and easy and cheap method for preparing low dielectric constant polyimide porous film, to solve the problem of expensive raw materials and low operating cost in the existing low dielectric constant polyimide porous film preparation method. The process is complicated, the technology is cumbersome, and the cost is high

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of low dielectric constant polyimide porous film and preparation method thereof
  • A kind of low dielectric constant polyimide porous film and preparation method thereof
  • A kind of low dielectric constant polyimide porous film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Dissolve 3 mg of polyimide and 0.3 mg of dodecyldimethylammonium bromide in 5 mL of dichloromethane to prepare a polyimide organic solution, and mix 1 mL of this polyimide organic solution with 50 µL Mix with deionized water, sonicate for 10 min, filter with a 220 nm organic filter head, take 200 µL of the filtrate and pour it on a clean glass substrate at a temperature of 30 °C and a humidity of 53%. After the volatilization was complete, an ordered polyimide porous membrane with a pore diameter of about 3.6 µm and a pore depth of about 7.8 µm was prepared.

[0030] attached figure 1 It is a scanning electron microscope picture of the prepared polyimide porous membrane. It can be seen that in the polyimide porous membrane, the pore size presents the characteristics of multi-level distribution, including larger holes in the upper layer and smaller holes in the bottom. The large pores in the upper layer are uniform in size and arranged in an orderly manner, showing a he...

Embodiment 2

[0033] As shown in Example 1, other conditions remain unchanged, the mass of polyimide is changed to 5.5 mg, the preparation of polyimide organic solution is carried out, and then the same operation steps are repeated to prepare macropores with a diameter of about 3.5 μm Compared with the non-porous polyimide film, the dielectric constant of the polyimide porous film is reduced from 3.20 to 2.64, which is a decrease of 17.42%.

Embodiment 3

[0035] As shown in Example 1, other conditions remain unchanged, the mass of polyimide is changed to 10 mg, the preparation of polyimide organic solution is carried out, and then the same operation steps are repeated to prepare macropores with a diameter of about 2.8 μm Compared with the non-porous polyimide film, the dielectric constant of the polyimide porous film is reduced from 3.20 to 2.72, which is a decrease of 14.76%.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
pore sizeaaaaaaaaaa
concentrationaaaaaaaaaa
pore sizeaaaaaaaaaa
Login to View More

Abstract

The invention belongs to the technical field of polyimide thin films, and relates to a low dielectric constant polyimide porous thin film and a preparation method thereof. The preparation method comprises the steps of preparation of a polyimide organic solution, mixing of the polyimide organic solution and deionized water, pouring and forming film after mechanical dispersion and the like. The preparation method has the characteristics that the equipment is simple, the condition is mild, the cost is low, the period is short, and the operation process and technique are simple and convenient. Because water drops are selected to serve as a hole forming template, the water drops do not have the advantage of being low in price, but also do not need to be removed through additional steps, therefore, damage to the structure and the property of the polyimide thin film is avoided while the operation steps are simplified. In addition, the structure of the polyimide porous thin film can be adjusted by changing the film forming condition, and accordingly regulation of the dielectric constant of the thin film is achieved. Compared with a non-porous polyimide thin film, the dielectric constant ofthe prepared polyimide porous film is obviously reduced, and the polyimide porous film is hopefully applied to the industries of electronics, micro electronics, spaceflight and the like.

Description

technical field [0001] The invention belongs to the technical field of polyimide film materials, and in particular relates to a low dielectric constant polyimide porous film and a preparation method thereof. Background technique [0002] Ordered microelectronics and large-scale integrated circuits are rapidly developing toward the field of miniaturization. Therefore, there is an urgent need for low-permittivity materials that can reduce power loss, capacitance-resistance time delay (RC), and leakage current. Polyimide has become a research hotspot in this field because of its rigid skeleton structure and the formation of macromolecular main chain diamines and dianhydride electron transfer complexes, which have excellent mechanical properties and chemical stability. However, the relatively high dielectric constant of polyimide cannot meet the requirements of some microelectronic products. Therefore, low dielectric constant polyimide film and its preparation are of great sign...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08J9/28
CPCC08J9/28C08J2201/0502C08J2201/0504C08J2379/08
Inventor 马英一徐乐
Owner HARBIN UNIV OF SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com