The invention belongs to the technical field of polyimide thin films, and relates to a low dielectric constant polyimide porous thin film and a preparation method thereof. The preparation method comprises the steps of preparation of a polyimide organic solution, mixing of the polyimide organic solution and deionized water, pouring and forming film after mechanical dispersion and the like. The preparation method has the characteristics that the equipment is simple, the condition is mild, the cost is low, the period is short, and the operation process and technique are simple and convenient. Because water drops are selected to serve as a hole forming template, the water drops do not have the advantage of being low in price, but also do not need to be removed through additional steps, therefore, damage to the structure and the property of the polyimide thin film is avoided while the operation steps are simplified. In addition, the structure of the polyimide porous thin film can be adjusted by changing the film forming condition, and accordingly regulation of the dielectric constant of the thin film is achieved. Compared with a non-porous polyimide thin film, the dielectric constant ofthe prepared polyimide porous film is obviously reduced, and the polyimide porous film is hopefully applied to the industries of electronics, micro electronics, spaceflight and the like.