Bonding composition

A technology of composition and viscosity, which is applied in the direction of assembling printed circuits with electrical components, inorganic adhesives, adhesive additives, etc., can solve the problems of not considering the formation of solder joints, hindering LED light emission, and difficult luminous intensity, etc., to achieve dispersion Excellent performance, suppression of solder joint formation, and improvement of dispersion state

Active Publication Date: 2018-07-31
BANDO CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

More specifically, if a fillet is formed in the junction, the light emission of the LED is hindered by the fillet, and it is difficult to maintain the luminous intensity for a long time due to the discoloration of the fillet over time.
However, in the joining material described in the above-mentioned Patent Document 1, the formation of the above-mentioned nugget is not considered at all.

Method used

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  • Bonding composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0152] 400 ml of toluene (a first-grade reagent manufactured by Wako Pure Chemical Industries, Ltd.) and 30 g of hexylamine (a first-grade reagent manufactured by Wako Pure Chemical Industries, Ltd.) were mixed and sufficiently stirred with a magnetic stirrer. Here, 10 g of silver nitrate (reagent special grade manufactured by Toyo Chemical Industry Co., Ltd.) was added while stirring, and after the silver nitrate was dissolved, 10 g of oleic acid (reagent grade manufactured by Wako Pure Chemical Industries Co., Ltd.) was added. . Here, a 0.01 g / ml aqueous sodium borohydride solution prepared by adding 1 g of sodium borohydride (manufactured by Wako Pure Chemical Industries, Ltd.) to 100 ml of ion-exchanged water was added dropwise to obtain a liquid containing silver microparticles.

[0153] After stirring for 1 hour, 300 ml of methanol (special grade reagent manufactured by Wako Pure Chemical Industries, Ltd.) was added to aggregate and settle the silver fine particles. Fur...

Embodiment 2

[0170] Composition 2 for joining was obtained in the same manner as in Example 1 except that the addition amount of oleic acid was 7 g. Various characteristics were evaluated in the same manner as in Example 1, and the obtained results are shown in Table 1.

Embodiment 3

[0172] Composition 3 for joining was obtained in the same manner as in Example 1 except that the addition amount of oleic acid was 15 g. Various characteristics were evaluated in the same manner as in Example 1, and the obtained results are shown in Table 1.

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Abstract

Provided is a bonding composition which can achieve high bonding strength by bonding at a relatively low temperature and which can suppress formation of fillets while maintaining suitable spreading atan interface to be bonded. The present invention relates to a bonding composition which contains inorganic particles as a primary component and an organic component as a secondary component, and which is characterized in that the viscosity decreases upon a rise in temperature and inorganic particles are sintered to each other following the decrease in viscosity. The viscosity at 25 DEG C of thisbonding composition is preferably 10-50 Pa*s at a shear rate of 10 s<-1>.

Description

technical field [0001] The present invention relates to a bonding composition comprising inorganic particles as a main component and an organic component as a subcomponent. Background technique [0002] In order to mechanically, electrically, and / or thermally join metal parts, solder, conductive adhesives, silver pastes, anisotropic conductive films, and the like have conventionally been used. These conductive adhesives, silver pastes, anisotropic conductive films, and the like are used not only when joining metal parts but also when joining ceramic parts, resin parts, and the like. For example, bonding of a light emitting element such as a light emitting diode (Light Emitting Diode, LED) to a substrate, bonding of a semiconductor chip to a substrate, bonding of these substrates to a heat dissipation member, and the like are exemplified. [0003] Among them, adhesives, pastes, and films containing solder and conductive fillers containing metals are used for joining parts th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F7/08B22F1/02C09J1/00C09J11/06H01B1/22H05K3/32B22F1/00B22F1/0545B22F1/102
CPCB22F7/08C09J1/00C09J11/06H01B1/22H05K3/32B22F7/064B22F9/24B22F1/0545B22F1/102B22F2304/054B22F2304/056H05K3/321
Inventor 中岛尚耶
Owner BANDO CHEM IND LTD
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