A solar silicon wafer wire saw cutting machine

Abstract

The invention discloses a solar silicon wafer saw blade cutter. The solar silicon wafer saw blade cutter comprises a supporting device and a cutting device mounted on the supporting device. The supporting device comprises a supporting bottom plate and a supporting side plate vertically fixed to the lower surface of the supporting bottom plate. A first threaded rod is fixed to the surface of the supporting bottom plate in a penetrating mode. A first gear is fixed to the surface of the first threaded rod. A shaft lever is fixed to the lower surface of the supporting bottom plate. A second gear is fixed to the surface of the shaft lever. The cutting device comprises a sliding frame and a linkage device mounted on the sliding frame. The sliding frame comprises a sliding plate, a side plate anda baffle, wherein the side plate and the baffle are vertically fixed to the sliding plate. The saw blade cutter is simple in structure and easy to operate and can be adjusted according to the width of steel wires and the width of cut solar silicon wafers, cutting fluid slurry is saved, the processing adaptability of the solar silicon wafer saw blade cutter is improved, and the cut silicon wafersare regular in shape.

Description

technical field [0001] The invention belongs to the technical field of solar silicon wafer manufacturing, and in particular relates to a solar silicon wafer wire saw cutting machine. Background technique [0002] As we all know, under the circumstance that fossil fuels are decreasing day by day, solar energy has become an important part of energy used by human beings, and it has been continuously developed. There are two ways to use solar energy: photothermal conversion and photoelectric conversion. Solar power is a new type of renewable energy. With the continuous development of solar cell technology, solar cells based on the photovoltaic effect have a bright application prospect. Solar cells are components assembled and packaged by solar silicon wafers, tempered glass, EVA, etc. [0003] During the production and processing of solar silicon wafers, steps such as polishing, chamfering, cutting, cleaning, and testing are required. In the cutting process of silicon wafers,...

AI Technical Summary

Problems solved by technology

The cutting fluid of the current cutting machine cannot be adjusted according to the wide band of the steel wire or the width of the silicon ingot, so that the cutting fluid is sprayed unevenly, which reduces the practicability of the wire saw and wastes the slurry; at the same time, the steel wire The cuts of silicon wafers obtained by cutting are relatively rough, and the cutting efficiency is low

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