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LTCC (Low Temperature Co-fired Ceramic) substrate material with low thermal expansion coefficient and preparation method thereof

A low thermal expansion coefficient, substrate technology, applied in LTCC substrate material with low thermal expansion coefficient and its preparation, LTCC substrate material and its preparation field, can solve the problems of low product qualification rate and difficult process realization, etc., and achieve a wide range of applications , good designability and large adjustment space

Active Publication Date: 2018-08-14
NAT UNIV OF DEFENSE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the microstructure and physical and chemical properties of glass-ceramic system materials are sensitive to the original components of the glass and the firing process, making it difficult to realize the process and the product qualification rate is low

Method used

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  • LTCC (Low Temperature Co-fired Ceramic) substrate material with low thermal expansion coefficient and preparation method thereof
  • LTCC (Low Temperature Co-fired Ceramic) substrate material with low thermal expansion coefficient and preparation method thereof
  • LTCC (Low Temperature Co-fired Ceramic) substrate material with low thermal expansion coefficient and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032]A kind of LTCC substrate material with low thermal expansion coefficient of the present invention, this LTCC substrate material is mainly prepared by borosilicate glass, β-spodumene and alumina as raw materials, as shown in Table 2, borosilicate glass, The mass ratio of β-spodumene to alumina is 50:35:15. Borosilicate glass is mainly H 3 BO 3 , SiO 2 , MgO, Li 2 CO 3 and Na 2 CO 3 Prepared as raw material, as shown in Table 1, H 3 BO 3 , SiO 2 , MgO, Li 2 CO 3 and Na 2 CO 3 The mass ratio is 30:60:6.5:1:2.5.

[0033] A kind of preparation method of the LTCC substrate material with low coefficient of thermal expansion of the present embodiment, comprises the following steps:

[0034] (1) First with H 3 BO 3 , SiO 2 , MgO, Li 2 CO 3 and Na 2 CO 3 As raw material, weigh and mix uniformly according to the ratio in Table 1, then raise the temperature to 1550°C at a heating rate of 10°C / min in an uncovered platinum crucible and keep it for 120min, then qui...

Embodiment 2～ Embodiment 10

[0041] Embodiments 2 to 10 mainly revolve around the composition of borosilicate glass, and the changes of the relative content of borosilicate glass, β-spodumene and alumina, and illustrate the impact of raw materials and formulas on the thermal expansion coefficient and dielectric strength of low thermal expansion LTCC substrate materials. influence on electrical performance.

[0042] Table 1 Raw material composition of borosilicate glass

[0043]

[0044] Raw material ratio and performance of LTCC substrate material in Table 2 embodiment 1 to embodiment 10

[0045]

[0046]

[0047] It can be seen from the above examples that the thermal expansion coefficient of the LTCC substrate material of the present invention is about 2.0-5.1ppm / °C, which is significantly lower than the current mainstream commercialized LTCC materials. The thermal expansion coefficient of the typical formulation of the present invention matches that of silicon chips. The advanced LTCC substra...

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Abstract

The invention discloses an LTCC (Low Temperature Co-fired Ceramic) substrate material with a low thermal expansion coefficient and a preparation method thereof. The LTCC substrate material is mainly prepared from borosilicate glass and a ceramic raw material; the ceramic raw material is beta-spodumene and / or aluminum oxide; the mass ratio of the borosilicate glass to the ceramic raw material is (35 to 60) to (40 to 65); the borosilicate glass is mainly prepared from raw materials including H3BO3, SiO2, MgO, Li2CO3 and Na2CO3 according to the mass ratio of (30 to 60) to (30 to 60) to (5 to 20)to (1 to 4) to 2.5. The preparation method comprises the following steps: firstly, preparing borosilicate glass dreg and carrying out ball milling to obtain powder; then mixing the powder with the ceramic raw material, granulating, pressing, dumping and sintering to obtain the LTCC substrate material. The LTCC substrate material disclosed by the invention has the advantages of low sintering temperature, small thermal expansion coefficient, excellent dielectric properties and the like.

Description

technical field [0001] The invention belongs to the field of electronic ceramic materials and manufacturing thereof, and relates to an LTCC substrate material and a preparation method thereof, in particular to an LTCC substrate material with a low thermal expansion coefficient and a preparation method thereof. Background technique [0002] Low temperature co-fired ceramics (Low Temperature Co-fired Ceramics, LTCC) technology is an ideal packaging technology to realize the miniaturization and chipping of electronic components. Using LTCC technology, analog circuits, digital circuits, optoelectronic devices and microwave devices can be assembled together, thus providing an excellent solution for the miniaturization, integration and high reliability of electronic equipment. and other fields have broad application prospects. [0003] Among the various materials involved in LTCC technology, the LTCC substrate material is the most critical basic material. In order to meet the pr...

Claims

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Application Information

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IPC IPC(8): C03C10/00
CPCC03C10/00
Inventor 陈兴宇张为军汪丰麟白书欣
Owner NAT UNIV OF DEFENSE TECH