Novel high-heat-conductivity graphene or graphite film/carbon fiber composite material preparation method

A technology of high thermal conductivity graphite and composite materials, which is applied in the field of preparation of new high thermal conductivity graphene or graphite film/carbon fiber resin matrix composite material laminates, and can solve problems such as difficult engineering applications, limited applications, and shortages.

Inactive Publication Date: 2018-08-17
PEKING UNIV +1
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

However, since the in-plane thermal conductivity of carbon fiber resin matrix composites mainly depends on the filling of high thermal conductivity carbon fibers, and the cost of high thermal conductivity carbon fibers is much higher than that of ordinary fibers, it is difficult to apply engineering, so there is no better way to improve engineering. Its in-plane thermal conductivity...

Method used

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  • Novel high-heat-conductivity graphene or graphite film/carbon fiber composite material preparation method
  • Novel high-heat-conductivity graphene or graphite film/carbon fiber composite material preparation method

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specific Embodiment

[0024] (1) Cut the 25μm thick graphene film into a size of 35mm×35mm, and use an industrial punch to punch the high thermal conductivity graphene film in advance to obtain a network graphene film, and obtain a 0.1-1mm diameter on the graphene film. Uniform voids. Here, 0.5 mm array punches are used to obtain uniformly distributed holes with a diameter of 0.5 mm on the graphene film. After the end, it is dried in a vacuum oven at 60 ° C for 60 min;

[0025] (2) Prepare the epoxy resin main agent, curing agent and diluent according to the ratio of 10:25:15 into a solution, stir on a magnetic stirrer for 5 minutes, and then evenly coat the resin solution on the network graphene film surface, to obtain a prepreg with a thickness of 0.03-0.1;

[0026] (3) Cut the carbon fiber resin prepreg (resin content is 30-40wt%, single-layer thickness is about 0.02mm) into 100mm×100mm size by using a paper knife and ruler, and put the cut prepreg Sealed in a ziplock bag;

[0027] (4) Spread ...

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Abstract

The invention belongs to the field of heat-conducting materials, and particularly relates to a preparation method of a novel high-heat-conductivity graphene film/carbon fiber heat-radiating plate. A graphene-carbon fiber resin matrix composite material is prepared from a graphene layer, a carbon fiber woven mesh layer and a vertical alignment carbon fiber reinforced layer. The graphene film is punched in advance through a stamping technology so as to obtain a meshy graphene film, and is then pre-impregnated with epoxy so as to obtain a prepreg. The graphene film and the carbon fiber sheet prepreg are sequentially laminated and paved, and then an ultrasonic impacting gun is used for driving a carbon fiber needling preform into a composite plate, or a needling method is used for vertically aligning part of carbon fiber, so that a shearing performance is improved. According to the preparation method provided by the invention, graphene powder and the carbon fiber sheet are compounded, so that the composite material has excellent heat conductivity and better machinability. The composite material plate can be used for heat radiation of a large-scale component, has a heat radiation performance similar to pure metal and other heat-radiating materials, and has cuttability and better flexibility. The material is simple in production process, energy-saving, environmental-friendly, high inapplicability, and capable of being produced in a large scale.

Description

technical field [0001] The invention belongs to the field of heat-conducting materials, and in particular relates to a preparation method of a novel high-heat-conducting graphene or graphite film / carbon fiber resin-based composite material laminate. Background technique [0002] With the rapid development of spacecraft, aerospace electronic components are increasingly moving towards high-density integration, which makes the problem of structural heat dissipation particularly prominent. The increase in the thermal load of the spacecraft, sometimes even reaching 10000kW, puts forward higher design requirements for the thermal conductivity of the material. Because heat dissipation is so important, even expensive materials with high thermal conductivity like diamond, metal matrix composites, and carbon matrix composites are used in high-end microelectronic systems. In addition, in satellite antennas and electronic systems, non-uniform temperature distribution will cause large t...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K7/06C08K3/04C09K5/14
CPCC08K7/06C08K3/042C09K5/14C08L63/00
Inventor 白树林张亚飞
Owner PEKING UNIV
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