Novel high-heat-conductivity graphene or graphite film/carbon fiber composite material preparation method

Abstract

The invention belongs to the field of heat-conducting materials, and particularly relates to a preparation method of a novel high-heat-conductivity graphene film / carbon fiber heat-radiating plate. A graphene-carbon fiber resin matrix composite material is prepared from a graphene layer, a carbon fiber woven mesh layer and a vertical alignment carbon fiber reinforced layer. The graphene film is punched in advance through a stamping technology so as to obtain a meshy graphene film, and is then pre-impregnated with epoxy so as to obtain a prepreg. The graphene film and the carbon fiber sheet prepreg are sequentially laminated and paved, and then an ultrasonic impacting gun is used for driving a carbon fiber needling preform into a composite plate, or a needling method is used for vertically aligning part of carbon fiber, so that a shearing performance is improved. According to the preparation method provided by the invention, graphene powder and the carbon fiber sheet are compounded, so that the composite material has excellent heat conductivity and better machinability. The composite material plate can be used for heat radiation of a large-scale component, has a heat radiation performance similar to pure metal and other heat-radiating materials, and has cuttability and better flexibility. The material is simple in production process, energy-saving, environmental-friendly, high inapplicability, and capable of being produced in a large scale.

Description

technical field [0001] The invention belongs to the field of heat-conducting materials, and in particular relates to a preparation method of a novel high-heat-conducting graphene or graphite film / carbon fiber resin-based composite material laminate. Background technique [0002] With the rapid development of spacecraft, aerospace electronic components are increasingly moving towards high-density integration, which makes the problem of structural heat dissipation particularly prominent. The increase in the thermal load of the spacecraft, sometimes even reaching 10000kW, puts forward higher design requirements for the thermal conductivity of the material. Because heat dissipation is so important, even expensive materials with high thermal conductivity like diamond, metal matrix composites, and carbon matrix composites are used in high-end microelectronic systems. In addition, in satellite antennas and electronic systems, non-uniform temperature distribution will cause large t...

AI Technical Summary

Problems solved by technology

However, since the in-plane thermal conductivity of carbon fiber resin matrix composites mainly depends on the filling of high thermal conductivity carbon fibers, and the cost of high thermal conductivity carbon fibers is much higher than that of ordinary fibers, it is difficult to apply engineering, so there is no better way to improve engineering. Its in-plane thermal conductivity; in addition, the resin matrix determines the out-of-plane thermal conductivity of the composite material. Since the thermal conductivity of the resin matrix is ​​very low (only 0.2~0.4W / (mK)), the out-of-plane thermal conductivity of the composite material is often poor. Only 0.6~1.2W / (mK); these factors limit its application in the fields of spacecraft and high-end electronic equipment

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