Laser processing device
A laser processing and laser technology, which is applied in the direction of laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve problems such as complex structure and easy-to-cause failures
Active Publication Date: 2021-11-30
DISCO CORP
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Problems solved by technology
However, in order to maintain the processing direction and the dispersion direction of the laser light in a predetermined relationship and improve productivity, a polygon mirror that rotates in the forward direction and a polygon mirror that rotates in the reverse direction are provided and rotated from the forward direction when the wafer is reciprocated. Switching the multi-faceted mirror to the structure of the anti-rotating polygon mirror, there is a problem that the structure becomes complicated and it is easy to induce failure
Method used
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Embodiment Construction
[0017] Hereinafter, an embodiment of the laser processing apparatus configured according to the present invention will be described in more detail with reference to the drawings.
[0018] exist figure 1 The whole perspective view of the laser processing apparatus 2 of this embodiment and the wafer 10 which is a to-be-processed object is shown in . The laser processing device 2 has: a holding unit 6, which holds the wafer 10; a moving unit 8, which is arranged on the stationary base 2a and moves the holding unit 6; The wafer 10 on the unit 6 is irradiated with laser light; and the frame body 50 is composed of a vertical wall portion 51 and a horizontal wall portion 52, and the vertical wall portion 51 is erected on the side of the mobile unit 8 on the stationary base 2a, The horizontal wall portion 52 extends horizontally from the upper end portion of the vertical wall portion 51 . The optical system of the laser light irradiation unit 24 is provided inside the horizontal wal...
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Abstract
Provided is a laser processing device which is simple in structure but capable of maintaining a predetermined relationship between the processing direction and the dispersion direction of laser light. The laser processing device (2) includes: a holding unit (6), which holds the processed object; a laser beam irradiation unit (24), which irradiates laser light to the processed object; an X-direction moving unit, which controls the holding unit and the laser beam. The light irradiating unit relatively performs processing feeding in the X direction; and a Y direction moving unit that relatively performs processing feeding of the holding unit and the laser ray irradiating unit in the Y direction perpendicular to the X direction, the laser ray irradiating unit includes : laser oscillator (242), which oscillates laser light; polygon mirror (245), which disperses laser light according to a prescribed dispersion angle and scans in the X direction; The up-scanning laser beam converges on the workpiece; and an inverter (246), which is arranged between the polygon mirror and the condenser, reverses the scanning direction of the laser beam.
Description
technical field [0001] The present invention relates to a laser processing device that uses a polygon mirror to disperse the irradiation direction of laser beams and irradiates a processing point with a plurality of laser beams. Background technique [0002] A cutting device having a rotatable cutting tool divides a wafer divided by dividing lines and has a plurality of devices such as ICs and LSIs formed on the front surface into individual devices, and is used in electronic equipment such as mobile phones and personal computers. [0003] In addition, in a wafer in which devices are formed by laminating several layers of low dielectric constant insulating films (Low-k films) on the upper surface of a semiconductor substrate such as silicon, when cutting the planned dividing line At this time, since the functional layer laminated on the planned dividing line is peeled off like mica, the quality of the device is reduced, so the applicant proposed the following technology: bef...
Claims
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IPC IPC(8): B23K26/364B23K26/402B23K26/08B23K26/064B23K26/70H01L21/78
CPCH01L21/78B23K26/0652B23K26/0876B23K26/364B23K26/402B23K26/702H01L21/67092B23K26/38H01L21/76
Inventor 能丸圭司
Owner DISCO CORP