Halogen-free resin composition and low-fluidity prepreg thereof

Abstract

The invention discloses a halogen-free resin composition and a low-fluidity prepreg thereof. The halogen-free resin composition comprises, by weight, 20-80 parts of an epoxy resin composition, 10-50 parts of phenoxy resin, 10-50 parts of a flame retardant, 3-30 parts of a toughening agent, 10-80 parts of an inorganic filler, 1-10 parts of a curing agent, 0-5 parts of an accelerator and 0-80 partsof an additive. The halogen-free resin composition obtained by modifying common epoxy resin with bisphenol F phenoxy resin, liquid epoxy resin and long chain-containing aliphatic epoxy resin has low viscosity and good wettability, and the low-fluidity prepreg produced from the halogen-free resin composition has the advantages of high flexibility, high Tg and bonding strength, excellent heat resistance, greenness, environmental protection, no resin dust, and realization of long-term preservation.

Description

technical field [0001] The invention relates to the field of resin materials for printed circuit boards, in particular to a halogen-free resin composition and a low-fluidity prepreg. Background technique [0002] With the development of electronic equipment in the direction of miniaturization and multi-function, the printed circuit board (PCB) is required to be highly dense and high-performance. In order to realize the three-dimensional installation of electronic products, more and more consideration is given to the use of rigid-flex Combining (rigid-flexible) technology, so the rigid-flexible PCB is developing faster and faster. [0003] Low resin fluidity prepreg (No flow prepreg), compared with ordinary FR-4 adhesive sheet (prepreg), its B-stage resin does not flow glue or rarely flows glue under high temperature and high pressure, and at the same time has good adhesion and other properties , suitable for connecting rigid PCB boards and flexible PCB boards, so it is wide...

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Problems solved by technology

[0004] So far, in the patent CN 102775734A, the core-shell rubber is used to modify the main resin. Although the toughening effect can be achieved, it will cause a decrease in the glass transition temperature (Tg), which is different from that of the polyimide (PI) film. Poor binding force, poor heat resistance, and easy precipitation of rubber components and poor weather resistance

In CN 102311614B, by introducing a large amount of bisphenol A type phenolic resin and biphenyl epoxy resin, it overcomes the phenomenon that Tg is reduced due to the introduction of core-shell rubber, but the overall viscosity of the resin glue will increase, which is relatively Corresponds to poor wettability of reinforcement materials

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