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The processing method of the processed object

A technology of processed objects and processing methods, which is applied in metal processing, stone processing equipment, metal processing equipment, etc., can solve the problems of chip flexural strength reduction, etc., and achieve the improvement of chip flexural strength, chip separability, and adhesion prevention The effect of dirt

Active Publication Date: 2021-05-25
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

On the other hand, when a modified layer remains in a chip produced by grinding and thinning the workpiece after laser processing, there is a problem that the flexural strength of the chip decreases.

Method used

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  • The processing method of the processed object
  • The processing method of the processed object
  • The processing method of the processed object

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Embodiment Construction

[0025] Hereinafter, the processing method of the processed object implementing the present invention will be figure 1 Each step in the case where the shown workpiece W is divided into individual device chips will be described. figure 1 The workpiece W shown is, for example, a circular semiconductor wafer made of a silicon substrate or the like, and devices D are formed in grid-like regions partitioned by streets S on the front surface Wa of the workpiece W. exist figure 1 The front surface Wa of the workpiece W facing the −Z direction side is attached to the dicing tape T having a larger diameter than the workpiece W, and the front Wa is protected by the dicing tape T. A ring-shaped frame F having a circular opening is attached to the outer peripheral region of the sticking surface of the dicing tape T, and the workpiece W is supported by the ring-shaped frame F through the dicing tape T, and becomes operable via the ring-shaped frame F. state.

[0026] (1) Laser beam irrad...

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Abstract

Provided is a method of processing a workpiece, which improves the flexural strength of the chip when a modified layer is formed and then the workpiece is divided into chips. A method of processing a workpiece (W), the workpiece (W) has a front surface (Wa) provided with a plurality of spacer lanes (S), wherein the method of processing the workpiece (W) includes the following The step of: the laser beam irradiation step, positioning the focus point of the laser beam with a wavelength that is transparent to the workpiece (W) inside the workpiece (W), and aligning the processed object (W) along the interval road (S) The back side (Wb) of the object (W) is irradiated with a laser beam to form a modified layer (ML) along the spacer (S) and extend a crack (C) from the modified layer (ML) to the front side (Wa); and In the cutting step, after the laser beam irradiation step is performed, while supplying cutting fluid to the workpiece (W), the back surface (Wb) of the workpiece (W) is treated with the cutting tool (60) along the spacer (S). Cutting is performed to remove the modified layer (ML).

Description

technical field [0001] The present invention relates to a method of processing workpieces such as semiconductor wafers. Background technique [0002] A processing method called stealth dicing is put into practical use, in which the focus point of a laser beam having a wavelength that is transparent to a workpiece such as a semiconductor wafer is positioned inside corresponding to a planned dividing line called a street On the other hand, irradiation is performed from the back side to form a modified layer inside the workpiece, and an external force is applied to the modified layer to divide the workpiece into individual chips (for example, refer to Patent Document 1). [0003] Patent Document 1: Japanese Patent No. 3408805 [0004] In stealth dicing, in order to improve the divisibility into chips, it is preferable to perform laser processing on the workpiece under the condition that cracks are generated from the modified layer to the front surface. On the other hand, when...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/304B23K26/00B23K26/53B28D5/02B28D7/00B28D7/04H01L21/78
CPCB23K26/53B23K26/0093B28D5/0011B28D5/0082B28D5/022H01L21/78B23K2103/56B23K2101/40H01L21/76B23K26/38B23K26/0665B23K26/0853B23K26/57H01L21/304H01L21/322
Inventor 淀良彰
Owner DISCO CORP
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