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A kind of quantum dot LED and preparation method

A technology of quantum dots and quantum dot layers, which is applied to semiconductor devices, electrical components, circuits, etc., can solve problems such as temperature rise, luminous efficiency reduction, and fluorescence efficiency reduction, and achieve smooth surface, uniform thickness, and improved light output efficiency. Effect

Active Publication Date: 2020-06-09
HUIZHOU CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, due to the serious temperature quenching of quantum dots, the temperature rises and the luminous efficiency decreases.
In addition, if the quantum dots are exposed to the water and oxygen environment, the fluorescence efficiency will decrease rapidly and irreversibly. Therefore, at present, the quantum dots need to be isolated from the water and oxygen environment, isolated from high temperature or have a better heat dissipation environment.

Method used

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  • A kind of quantum dot LED and preparation method
  • A kind of quantum dot LED and preparation method
  • A kind of quantum dot LED and preparation method

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Embodiment Construction

[0033] The following descriptions of various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present invention can be implemented.

[0034] Please refer to image 3 As shown, Embodiment 1 of the present invention provides a quantum dot LED, including:

[0035] A pair of electrodes 1 arranged side by side and spaced apart;

[0036] A flip-chip LED chip 2 disposed on the electrode 1 and electrically connected to the electrode 1;

[0037] A quantum dot interlayer disposed on the flip-chip LED chip 2;

[0038] An encapsulation layer 5 covering the electrode 1, the flip-chip LED chip 2, and the quantum dot interlayer;

[0039] A white glue layer 6 surrounding the encapsulation layer 5 .

[0040] Specifically, this embodiment adopts the flip-chip LED chip 2 , which has good heat dissipation, high reliability, can withstand high current driving, and has high cost performance.

[0041] The quantum dot interlayer specifically includes...

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Abstract

Provided in the present invention is a quantum dot LED and a manufacturing method, the quantum dot LED comprising: a pair of electrodes provided side by side and spaced apart; a flip-chip LED chip provided on the electrodes and electrically connected to the electrodes; a quantum dot interlayer provided on the flip-chip LED chip; a packaging layer encapsulating the electrodes, the flip-chip LED chip, and the quantum dot interlayer; and a white glue layer surrounding the packaging layer. In the present invention, a quantum dot interlayer is provided, preventing external moisture and oxygen from corroding a quantum dot layer and an LED chip, providing an environment for insulating moisture and oxygen for quantum dots, and aiding the improvement of the luminous efficiency and service life of quantum dots; an organic layer of a micro-nano structure is provided, improving the light extraction efficiency; and an inorganic packaging layer is formed by means of atomic layer deposition, so that the inorganic packaging layer can have a flat surface and a uniform thickness, and the problem of film layer cracking does not occur.

Description

technical field [0001] The invention relates to the technical field of screen display, in particular to a quantum dot LED and a preparation method. Background technique [0002] Quantum Dot (Quantum Dot, QD) is a semiconductor nanostructure that binds conduction band electrons, valence band holes and excitons in three spatial directions, also known as nanocrystals. Nanoparticles composed of III-V elements. The particle size of quantum dots is generally between 1 and 10 nm. Since electrons and holes are quantum-confined, the continuous energy band structure becomes a discrete energy level structure with molecular characteristics, and can emit fluorescence after being excited. CSP (Chip Scale Package) LED, as a kind of LED without bracket, has become an important development direction of LED because of its simple manufacturing process, good heat dissipation, and small light-emitting surface. [0003] figure 1 is the absorption spectrum diagram of red light quantum dots and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/54H01L33/58H01L33/50
CPCH01L33/507H01L33/54H01L33/58H01L33/504H01L33/56H01L33/62H01L2933/005H01L2933/0091
Inventor 樊勇
Owner HUIZHOU CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD
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