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A conductive composition for low frequency EMI shielding

A technology of composition and mixture, applied in the direction of conductive materials dispersed in non-conductive inorganic materials, magnetic field/electric field shielding, circuits, etc., can solve the problem of not providing sufficient shielding effectiveness

Active Publication Date: 2018-08-31
HENKEL KGAA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

High conductivity alone does not provide sufficient shielding effectiveness for EMI shielding at this MHz level

Method used

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  • A conductive composition for low frequency EMI shielding
  • A conductive composition for low frequency EMI shielding
  • A conductive composition for low frequency EMI shielding

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0123] volume resistance

[0124] figure 1 Exemplary shapes used to define the term "volume resistance" are shown.

[0125] R=ρL / S[Ω, ohm]

[0126] ρ: at 25°C, with a length of 1 m and a cross-sectional area of ​​1 mm 2 The (volume) resistivity of the conductor.

[0127] Volume resistance: ρ=RS / L[μΩ m, μohm.m, 10E-4ohm.em]

[0128] Agilent 34401A digital multimeter, Gen Rad 1689 Precision RLC Digibridge were used in the measurement.

[0129]A special four point probe test fixture is made of acrylic material with four spring loaded contact points. The contacts were set into the acrylic so that the current contacts were two inches (5.08 em) apart, the voltage contacts were between two current contacts, and the voltage contacts were 0.5 inches (1.27 cm) from each current contact .

[0130] Sample Preparation:

[0131] Two rolls of 3M Magic Scotch Tape were loaded into the jig 0.1" (0.254 cm) apart.

[0132] Slide a cleaned glass slide with two parallel Scotch tapes 0.1" ...

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Abstract

The present invention relates to a conductive composition for low frequency EMI shielding. An EMI shielding composition according to the present invention comprises a resin comprising a thermoplasticresin and / or a thermoset resin, a solvent and / or a reactive diluent and particles, wherein said particles comprise a mixture of magnetic particles and electrically conductive particles or magnetic particles coated with electrically conductive material or a mixture of magnetic particles coated with electrically conductive material and electrically conductive particles and wherein, said compositioncomprises >= 10%magnetic particles by weight, by total weight of the composition. The EMI shielding composition according to the present invention has good electrical and magnetic conductivity and issuitable as a drop-in solution for EMI shielding in a wide frequency range, and especially at low frequency ranges.

Description

technical field [0001] This invention relates to conductive compositions for low frequency EMI shielding. The composition of the invention has good electrical and magnetic conductivity and is suitable as a drop-in solution for EMI shielding over a wide frequency range, and especially at low frequency ranges. Background technique [0002] Electromagnetic interference (EMI) shielding is required for a variety of radio frequency (RF) electronic components primarily used in wireless communications. [0003] The most common EMI shielding solution is to use a metal cover or can to cover the target area or component. However, this technical solution cannot meet the continuously increasing demand for miniaturization (thinner and thinner packaging), smaller footprint and higher packaging density of electronic components. Therefore, this solution cannot be used in some micro-devices due to the excessive space required by the metal cover / cover. [0004] One industry approach is to u...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00C09K3/00
CPCH05K9/0083H01L23/552H01L23/66C09K3/00H01B1/22H05K9/0088
Inventor 黄晨宇严丽黎吴起立何锡平L·姚
Owner HENKEL KGAA