Coil structure and preparation method of composite coil structure
A composite coil and coil technology, which is applied in coil manufacturing, inductance/transformer/magnet manufacturing, inductors, etc., can solve the problems of thick overall antenna, complex preparation process, heat generation, etc., achieve optimized performance, simplify the preparation process, reduce The effect of production costs
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Embodiment 1
[0053] Such as figure 1 As shown, this embodiment provides a preparation method of a coil structure, the preparation method comprising:
[0054] Provide a laminated structure 11, the laminated structure 11 sequentially includes an adhesive layer 111, a metal layer 112 and an insulating layer 113 from bottom to top;
[0055] Die-cutting the laminated structure 11 by a die stamping process to form a coil 12; and
[0056] Provide a flexible circuit board 13 with conductive lines 132 and gold fingers 133 , and electrically connect the coil 12 and the gold fingers 133 through the conductive lines 132 to form the coil structure 10 .
[0057] As an example, such as figure 2 As shown, the method for forming the laminated structure 11 includes:
[0058] providing an adhesive layer 111 and a metal layer 112, and hot pressing the metal layer 112 on the adhesive layer 111 by using a hot pressing process; and
[0059] The insulating layer 113 is formed on the metal layer 112 by a spra...
Embodiment 2
[0086] Such as Figure 7 As shown, this embodiment provides a preparation method of a composite coil structure, the preparation method comprising:
[0087] providing a heat dissipation layer 20 and a shielding layer 30, and attaching the shielding layer 30 to the upper surface of the heat dissipation layer 20; and
[0088] A coil structure 10 prepared by the preparation method described in Embodiment 1 is provided, and the coil structure 10 is attached to the upper surface of the shielding layer 30 to form the composite coil structure 100 .
[0089] As an example, a roll-to-roll embossing process or a sheet embossing process is used to attach the shielding layer to the upper surface of the heat dissipation layer.
[0090] Specifically, the heat dissipation layer 20 includes a graphite sheet; the shielding layer 30 includes a lamination of sendust, ferrite or glue layer and nanocrystals, wherein the number of laminations is greater than one; preferably, In this embodiment, th...
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Abstract
Description
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