A chip-scale ultra-miniature refrigerator for uncooled infrared detectors

A technology of infrared detectors and refrigerators, which is applied in the field of micro-electromechanical systems, can solve the problems of large mechanical movement noise, poor reliability, and heavy weight, and achieve the effects of small thermal inertia, heat conduction prevention, and simple structure

Active Publication Date: 2019-12-13
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Traditional chip-level thermoelectric, thermoacoustic, microfluidic, and MEMS Stirling refrigerators have defects such as large size, heavy weight, poor reliability, and large mechanical motion noise, which limits their popularization and application.

Method used

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  • A chip-scale ultra-miniature refrigerator for uncooled infrared detectors
  • A chip-scale ultra-miniature refrigerator for uncooled infrared detectors
  • A chip-scale ultra-miniature refrigerator for uncooled infrared detectors

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Embodiment Construction

[0026] The technical solutions provided by the present invention will be described in detail below in conjunction with specific examples. It should be understood that the following specific embodiments are only used to illustrate the present invention and are not intended to limit the scope of the present invention.

[0027] The chip-level ultra-miniature refrigerator for unrefrigerated infrared detector provided by the invention, such as figure 1 As shown, it consists of two parts, including an outer packaging layer structure 1 and an inner refrigerator structure 5 . The inner refrigerator structure 5 is pasted on the bottom heat dissipation layer 1-4 of the outer packaging layer structure 1 . The outer encapsulation layer structure 1 is composed of a heat dissipation layer 1-4, a radiation protection layer 1-3, a vacuum encapsulation shell 1-2, and an infrared sensitive window 1-1 is set. The inner refrigerator structure 5 is composed of three parts, including an upper stru...

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Abstract

The invention provides a chip-level ultra-miniature refrigerator for an unrefrigerated infrared detector, which includes an outer packaging layer structure and an inner layer refrigerator structure. The outer packaging layer structure includes a vacuum packaging shell, a radiation protection layer, a heat dissipation layer, the top of the vacuum package shell is provided with an infrared sensitive window; the inner layer refrigerator structure includes an upper layer structure, a middle layer structure and a lower layer structure. The present invention maintains a constant temperature by heating and cooling the nano-film thermoelectric layer, effectively blocking the heat exchange between the support structure and the external environment through the base, and laying a heat insulation layer on the bottom of the base to further inhibit the heat conduction of the external environment . The ring-shaped cantilever beam setting and the supporting structure further prevent heat conduction, while the heat insulation layer setting further inhibits the internal heat conduction exchange, and realizes the thermal isolation of the infrared detector from the external environment. At the same time, heat radiation is suppressed by depositing and growing a radiation-proof layer, and vacuum packaging is used to prevent internal and external heat convection exchange.

Description

technical field [0001] The invention relates to a chip-level ultra-miniature refrigerator for an unrefrigerated infrared detector, which belongs to the technical field of micro-electromechanical systems. Background technique [0002] Different from traditional mechanical microrefrigerators, chip-level ultramicrorefrigerators based on nano-film materials have the advantages of simple structure, variable size and shape, high integration, high heat flux density, small thermal inertia, fast temperature control and cooling speed, and no It needs refrigeration medium, does not produce mechanical noise and other advantages, and solves the refrigeration problem in various occasions. It has broad application prospects in the fields of electronic power, national defense, industry, scientific research, and life, especially in the application of refrigeration for micro-miniature infrared detectors, and has a huge application prospect. [0003] Traditional chip-level thermoelectric, the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/024H01L25/16H01L35/28
CPCH01L25/167H01L31/024H10N10/10
Inventor 杨波冯雨郭鑫李成高小勇
Owner SOUTHEAST UNIV
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