A kind of packaging method of power device and power device

Abstract

The invention provides a packaging method for a power device, and the power device. The packaging method comprises the following steps: preparing metal adhesion layers in routing windows; forming a waterproof protection layer and an aluminum wire contact window on each metal adhesion layer; depositing metal aluminum in each aluminum wire contact window, and filling each aluminum wire contact window with the metal aluminum to form a patching panel; and carrying out routing packaging on the patching panels. The packaging method and the power device provided by the invention have the advantages that routing, which is originally carried out on a power chip metal layer, is carried out on the patching panels on a passivation layer instead, and the waterproof protection layers are additionally arranged in the routing windows, so that the reliability and the waterproof performance of the device can be greatly improved; meanwhile, the sizes of the patching panels on the surface can be adjustedat any time, so as to facilitate the routing for different wire diameters; and even if the wire diameter is small, the patching panels are also relatively small, and a chip can be protected through the waterproof protection layers in the passivation windows below, so that high reliability is achieved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a power device packaging method and the power device. Background technique [0002] With the wide application of semiconductor technology in industrial production automation, computer technology, and communication technology, and the increasing complexity of electronic equipment, the reliability requirements for power devices are also getting higher and higher. The impact of water vapor on devices is as early as packaging Appeared when the device appeared. With the development of electronic integration technology, the size of power devices is getting smaller and smaller, and the line width on the chip is getting narrower and narrower. Widespread demands on complex electronic systems require higher reliability of key electronic integrated circuits in the system. Compared with hermetic packaging such as ceramics, plastic packaging has the advantages of light weight, small ...

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Problems solved by technology

Moreover, at high temperature, water vapor will reduce the glass transition temperature, elastic modulus and strength of the molding compound; water vapor will also cause the hardening of the molding compound and change the dielectric constant of the molding compound.

[0003] At present, most power devices are packaged in plastic, and water vapor has an increasing impact on the reliability of packaged devices. The intrusion of water vapor will cause oxidation and corrosion of metal leads in power devices.

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