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Method for preparing diamond abrasive tool with orderly arrangement of abrasive grains by using mask plate

A technology of diamond and mask, which is applied in the direction of manufacturing tools, grinding devices, metal processing equipment, etc., can solve the problem of poor manufacturability and difficulty in realizing the single-layer brazing of fine-grained diamond abrasives. Welding and brazing bond layer thickness and other problems, to achieve the effect of good consistency of exposed height, conducive to mass production, and simple equipment

Active Publication Date: 2020-06-12
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is aimed at the orderly arrangement of single-layer diamond abrasive tools (1) the thickness of the brazing bond layer is thick and the uniformity is difficult to control, and it is difficult to realize the single-layer brazing of the orderly arrangement of fine-grained diamond abrasives; (2) The fluidity of the solder affects the orderly arrangement of the diamond abrasive grains (3) The orderly arrangement has technical defects such as poor manufacturability. Deposited Diamond Abrasive Tools

Method used

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  • Method for preparing diamond abrasive tool with orderly arrangement of abrasive grains by using mask plate
  • Method for preparing diamond abrasive tool with orderly arrangement of abrasive grains by using mask plate
  • Method for preparing diamond abrasive tool with orderly arrangement of abrasive grains by using mask plate

Examples

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Effect test

Embodiment 1

[0044] The substrate is silicon carbide ceramics, the abrasive is 100-mesh diamond powder, the thickness of the mask plate is 150 μm, and the surface is etched with a matrix-shaped through-hole array arranged in an orderly manner, and the diameter of the through-hole is 200 μm.

[0045] The surface of the substrate was ground with 15 μm diamond micropowder for 1 min, and then the substrate was ultrasonically cleaned with acetone. Then coat the photoresist on the surface of the substrate, and stick the mask on the surface of the substrate. Then, the diamond powder is spread on the mask, and the substrate is fully vibrated, so that each hole of the mask is filled with a single diamond grain. The excess diamond grit is then wiped off and the mask is removed. The orderly arranged diamond abrasive grains are fixed on the surface of the substrate. Then, the diamond coating is deposited on the surface of the substrate by hot wire chemical vapor deposition equipment, and the abrasiv...

Embodiment 2

[0050] The substrate is cemented carbide, the abrasive is 100-mesh diamond powder, the thickness of the mask plate is 150 μm, and the surface is etched with a matrix-shaped through-hole array arranged in an orderly manner, and the diameter of the through-hole is 200 μm.

[0051] The cemented carbide substrate is pretreated with acid and alkali, and the cemented carbide substrate is first immersed in Murakami solution (10g K 3 [Fe(CN)] 6 +10g KOH+100mL H 2 O) in ultrasonic treatment for 30min, then soak it in mixed acid (HCl: H 2 o 2 =1:3) for 1 minute to remove the cobalt element on the surface, and then clean the surface of the substrate with acetone. Then coat the photoresist on the surface of the substrate, and stick the mask on the surface of the substrate. Then the diamond powder is spread on the mask, and the tool substrate is fully vibrated, so that each hole of the mask is filled with a single diamond grain. The excess diamond grit is then wiped off and the mask i...

Embodiment 3

[0054] The substrate is silicon carbide, the abrasive is 170-mesh diamond powder, the thickness of the mask is 100 μm, and the surface is etched with a matrix-shaped through-hole array arranged in an orderly manner, the diameter of the through-holes is 100 μm, and the spacing is 200 μm.

[0055] The surface of the substrate was ground with 15 μm diamond powder for 1 min, and then the substrate was ultrasonically cleaned with acetone. Then coat the photoresist on the surface of the substrate, and stick the mask on the surface of the substrate. Then, the diamond powder is spread on the mask, and the substrate is fully vibrated, so that each hole of the mask is filled with a single diamond grain. The excess diamond grit is then wiped off and the mask is removed. The orderly arranged diamond abrasive grains are fixed on the surface of the substrate. Then, the diamond coating is deposited on the surface of the substrate by hot wire chemical vapor deposition equipment, and the abr...

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Abstract

The invention provides a method for preparing a diamond abrasive material tool with orderly distributed abrasive particles by utilizing a mask through single-layer chemical vapor deposition. The method comprises the following steps of after pretreating a substrate, coating a photoresist on the surface, and paving the mask on the surface of the photoresist; distributing diamond abrasive materials on the surface of the mask, vibrating the substrate, and enabling the abrasive materials to enter distribution holes of the mask; and removing excess diamond abrasive materials outside the distributionholes, taking the mask down, carrying out chemical vapor deposition on the substrate adhered with the diamond abrasive materials, forming a diamond coating, and obtaining the diamond abrasive material tool. Compared with the prior art, the method provided by the invention has the following beneficial effects that (1) the method provided by the invention can be used for preparing the tool with theorderly distributed diamond abrasive materials with the fine granularity being 100mum, and is suitable for precision grinding machining; and (2) the method provided by the invention is simple in adopted equipment, less in steps, simple and convenient to operate, and beneficial to mass production.

Description

technical field [0001] The invention relates to a method for preparing diamond abrasive tools by single-layer chemical vapor deposition, which belongs to the technical field of abrasive tools. Background technique [0002] Single-layer diamond abrasive tools occupy a dominant position in the field of high-efficiency and precision grinding of diamond superabrasive tools, and are widely used in precision grinding of brittle and hard materials such as glass, ceramics, semiconductor materials, and optical crystals because of their excellent grinding performance. processing. The abrasive grains of traditional diamond abrasive tools are randomly distributed, which is prone to enrichment and segregation. In the area where abrasive grains are enriched, the concentration of abrasive grains is too high, repeated wear is serious, and the surface of the tool is easy to block and hinder the flow of abrasive debris; in the area where abrasive grains are scarce, a single abrasive grain be...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D18/00
CPCB24D18/00
Inventor 孙方宏申笑天
Owner SHANGHAI JIAO TONG UNIV
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