Lift gate device and wafer transfer system

Abstract

The invention belongs to the semiconductor processing technology field and particularly relates to a lifting gate device and a wafer transfer system. The lifting gate device comprises a connection module, a positioning module, a transmission module and a power module, wherein the connection module is used for connecting a chamber door and a chamber and is movably connected with the positioning module, the positioning module is arranged on an outer wall of the chamber perpendicular to a plane of the chamber door and is used for adjusting the distance of the chamber door relative to the chamberand limiting the transmission module at the relative movement position of the outer wall of the chamber, the power module is arranged at one end of the chamber, is connected with the transmission module and is used for providing power for the transmission module, and the transmission module is arranged on an outer wall of the chamber perpendicular to the plane of the chamber door, is movably connected with the positioning module and is used for moving in the direction parallel to the plane of the chamber door under the driving power of the power module. The lifting gate device is advantaged inthat the structure is simple, assembling and debugging are simple, up and down movement of the chamber door can be accurately limited, and the chamber door is always parallel with the chamber in thecompression and opening process.

Description

technical field [0001] The invention belongs to the technical field of semiconductor processing, and in particular relates to a lifting door device and a wafer transmission system. Background technique [0002] In the semiconductor manufacturing process (such as 8-inch wafers), the wafers to be processed need to be gradually transferred from the atmosphere to a sealed reaction chamber for processing, such as etching process (Etch), physical vapor deposition process (PVD) Wait. To transfer the wafer to the reaction chamber, a wafer transfer system consisting of a series of atmospheric equipment and vacuum equipment is required, such as figure 1 Shown is a partial schematic diagram of a common semiconductor process wafer transfer system. [0003] figure 1 Among them, the transport system consists of a loading chamber 102 (Loadlock), a vacuum manipulator 103 (Vacuum Robot), a transport chamber 104 (Transport Chamber), and a process chamber 105 (Process Chamber), wherein the ...

AI Technical Summary

Problems solved by technology

[0010] The technical problem to be solved by the present invention is to provide a lifting door device and a wafer transmission system for the above-mentioned deficiencies in the prior art, which at least partially solve the problem that the structure of the lifting door device in the prior art is relatively complicated, there are many parts, and the assembly and debugging are complicated and, it is difficult to maintain the same linear coefficient in the production process of the spring, and there will be problems of different forces on the connecting rod structure at both ends and different wear on both sides

Images