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Easy-to-peel carrier foil as well as preparation method and application thereof

A carrier foil and easy peeling technology, which is applied in the manufacture of printed circuits, the manufacture of printed circuit precursors, electrical components, etc., can solve the problem that the carrier foil layer and the ultra-thin copper foil layer are partially peeled off, cannot be peeled off, and the peeling strength of the carrier foil is unstable. And other issues

Inactive Publication Date: 2018-09-14
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of this, the present invention provides an easy-peelable carrier foil and its preparation method and application, which can effectively solve the problem that the existing peeling layer easily makes the peeling strength of the carrier foil unstable at high temperature, resulting in carrier foil layer and ultra-thin copper Technical defect in which the foil layer is partially peeled off or not peeled off at all

Method used

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  • Easy-to-peel carrier foil as well as preparation method and application thereof
  • Easy-to-peel carrier foil as well as preparation method and application thereof
  • Easy-to-peel carrier foil as well as preparation method and application thereof

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preparation example Construction

[0042] The invention also discloses a method for preparing an easy-peelable carrier foil, which includes the following steps:

[0043]Step 1: roughening the surface of the carrier foil to obtain a roughened carrier foil 2;

[0044] Step 2: Adhere to the graphite-like material 3 on the rough surface of the roughened carrier foil 2 by chemical vapor deposition or magnetron sputtering to obtain an easy-to-peel carrier foil.

[0045] Application of the easy-peelable carrier foil disclosed in the present invention or the easy-peelable carrier foil prepared by the above method for preparing the easy-peelable carrier foil in the preparation of ultra-thin copper foil.

[0046] Specifically, the above application includes the following steps:

[0047] Step 1: roughening the surface of the carrier foil to obtain a roughened carrier foil 2;

[0048] Step 2: attach graphite material 3 to the rough surface of the roughened carrier foil 2 to obtain an easy-to-peel carrier foil;

[0049] ...

Embodiment 1

[0055] The specific embodiment of the present invention provides a preparation method and application of an easy-peelable carrier foil. Example 1 includes the following steps:

[0056] Step 1: Take a piece of carrier copper foil with a thickness of 20 microns;

[0057] Step 2: forming a raised structure on the carrier copper foil by photochemical etching;

[0058] Step 3: Electroplate graphite on the surface of the raised structure of the carrier copper foil by CVD, and the graphite surface (the side away from the raised structure of the carrier copper foil) is smooth and flat;

[0059] Step 4: Prepare an ultra-thin copper foil with a thickness of 2 microns by electroless plating on a smooth and flat graphite surface;

[0060] Step 5: hot pressing on the carrier copper foil by means of hot pressing, and completely peeling off the carrier copper foil and the ultra-thin copper foil.

[0061] Specifically, the graphite surface (the side away from the convex structure side of th...

Embodiment 2

[0063] The specific embodiment of the present invention provides a preparation method and application of an easy-peelable carrier foil, and embodiment 2 includes the following steps:

[0064] Step 1: Take a piece of carrier aluminum foil with a thickness of 25 microns;

[0065] Step 2: forming a raised structure on the carrier aluminum foil by photochemical etching;

[0066] Step 3: The surface of the raised structure of the carrier aluminum foil is coated with graphite by CVD, and the graphite surface (the side away from the raised structure of the carrier aluminum foil) is smooth and flat;

[0067] Step 4: Prepare an ultra-thin copper foil with a thickness of 3 microns by electroless plating on a smooth and flat graphite surface;

[0068] Step 5: hot pressing on the carrier aluminum foil by means of hot pressing, and completely peel off the carrier aluminum foil and the ultra-thin copper foil.

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Abstract

The invention belongs to the technical field of semiconductors and particularly relates to an easy-to-peel carrier foil as well as a preparation method and application thereof. The easy-to-peel carrier foil provided by the invention comprises a carrier foil after roughening treatment and a graphite material; the graphite material is adhered onto the surface of the carrier foil after roughening treatment. The invention further discloses a preparation method of the easy-to-peel carrier foil and application of the easy-to-peel carrier foil to the preparation of an ultra-thin copper foil. The invention overcomes the technical defect that an existing peeling layer easily enables the peeling strength of the carrier foil to be unstable at a high temperature, so that a carrier foil layer is partially peeled off from a ultra-thin copper foil layer or cannot be peeled off from the ultra-thin copper foil layer at all.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to an easy-peelable carrier foil and a preparation method and application thereof. Background technique [0002] In recent years, my country's electrolytic copper foil industry has developed rapidly. As the main raw material for printed circuit boards (PCBs), the development of electrolytic copper foils has been following the development of PCB technology. More than 95% of them are used in the manufacture of printed circuit board substrates, while PCB is constantly improving with the rapid development of electronic products. At present, electronic products are developing in the direction of low cost, high reliability, high stability and high functionality. Therefore, newer and higher requirements are put forward for the performance and variety of electrolytic copper foil. There is a new development trend of copper foil, and its thickness is developing in the directi...

Claims

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Application Information

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IPC IPC(8): H05K3/02
CPCH05K3/025H05K2203/1152
Inventor 崔成强陈涛张昱曾宪陈新
Owner GUANGDONG UNIV OF TECH
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