Preparation method of photocuring high-adhesion conductive silver paste

Abstract

The invention discloses a preparation method of a photocuring high-adhesion conductive silver paste. The preparation method belongs to the technical field of conductive silver paste preparation. According to the preparation method, an active diluting monomer consisting of 2,2,6,6-tetramethyl-l-piperidone and 1,6-hexanediol diacrylate does not participate in system reaction, plays connection and supplementation roles in the formation of a conductive pathway, so that conductive performance of silver powder per unit mass is improved. During ultraviolet curing, the temperature of the conductive silver paste is slowly increased, the viscosity of a resin matrix is lowered, and agglomeration and caking of the conductive silver paste can be effectively prevented when the conductive silver paste iscured, and the electrical conductivity of the conductive silver paste can be improved by improving dispersing capability of flake silver powder; in addition, during the ultraviolet curing process ofthe conductive silver paste, the conductive silver powder particles have discontinuous phases, the polyurethane resin matrix has continuous phases, and the conductive silver powder particles have goodgap filling effect for resin particles, thus the shrinkage rate is lowered when the conductive silver paste is cured, the conductive silver paste is not prone to be separated from the matrix after curing, and the application prospect is broad.

Description

technical field [0001] The invention discloses a preparation method of light-cured high-adhesion conductive silver paste, which belongs to the technical field of conductive silver paste preparation. Background technique [0002] Silver conductive paste is divided into two categories: polymer silver conductive paste; sintered silver conductive paste (sintered film, sintering temperature > 500 ° C, glass powder or oxide as the bonding phase). Silver powder is classified according to particle size, average particle size. [0003] Conductive silver paste is a silver paste that is printed on conductive substrates to enable it to conduct current and eliminate accumulated static charges. It is generally printed on non-conductive substrates such as plastics, glass, and ceramics. Conductive silver paste usually consists of conductive fillers, binders, solvents and additives. Conductive silver paste can also be used as conductive paste for mobile phone touch screen or as shieldin...

AI Technical Summary

Problems solved by technology

[0006] The technical problem mainly solved by the present invention is that the current conductive silver paste needs to be cured at low temperature when applied to the touch screen, and the filling amount of silver is relatively high, which leads to high production cost of the conductive silver paste. The curing shrinkage phenomenon of the paste causes the silver paste to detach from the base material after curing, which leads to the defect that the lap resistance increases, and provides a method for preparing a light-cured high-adhesion conductive silver paste