High-performance colloid for aluminum-based copper-clad plate and preparation method of high-performance colloid

Abstract

The invention relates to high-performance colloid for an aluminum-based copper-clad plate and a preparation method of the high-performance colloid. The high-performance colloid comprises, by mass percentage, 20-30% of resin matrix, 8-19% of curing agent, 9-21% of plasticizer, 1-2.1% of coupling agent, 40-55% of filler and the balance organic solvent. The preparation method includes: preprocessingraw materials, preprocessing resin, performing curing agent mixing, adding the solvent, adding the coupling agent, adding the plasticizer, adding silicon powder, regulating viscosity, and emulsifyingfor standby. The high-performance colloid and the preparation method thereof have the advantages that the high-performance colloid is convenient in raw material acquiring, low in raw material and processing costs, small in toxic and side effects and simple in processing and production process, colloidal liquid production efficiency can be increased effectively, production cost can be lowered, thethermal coefficient, high-temperature resistance and bending resistance of colloidal liquid can be increased effectively, and accordingly the high-temperature resistance and bending resistance of thealuminum-based copper-clad plate can be improved while the production and application costs of the aluminum-based copper-clad plate are lowered greatly.

Description

technical field [0001] The invention relates to a high-performance colloid for aluminum-based copper-clad laminates and a preparation method thereof, belonging to the technical field of production of aluminum-based copper-clad laminates. Background technique [0002] At present, in the production process of aluminum-based copper-clad laminates, the materials used to realize the bonding between aluminum substrates and copper foils are replaced by traditional glass cloth by adhesive films, thus greatly improving the structure of aluminum-based copper-clad laminates. Performance, heat dissipation performance and production efficiency, and reduce production costs, but found in the production process of aluminum-based copper clad laminates, the current adhesive film is often used as the basic raw material such as epoxy resin, aluminum oxide It is prepared by mixing fillers. Although it can meet the needs of use to a certain extent, the production process of glue preparation is co...

AI Technical Summary

Problems solved by technology

[0002] At present, in the production process of aluminum-based copper-clad laminates, the materials used to realize the bonding between aluminum substrates and copper foils are replaced by traditional glass cloth by adhesive films, thus greatly improving the structure of aluminum-based copper-clad laminates. Performance, heat dissipation performance and production efficiency, and reduce production costs, but found in the production process of aluminum-based copper clad laminates, the current adhesive film is often used as the basic raw material such as epoxy resin, aluminum oxide It is prepared by mixing fillers. Although it can meet the needs of use to a certain extent, the production process of glue preparation is complicated, and the cost of raw materials and production is relatively high. Aluminum-based copper-clad laminates have high hardness, poor high-temperature resistance, and are easy to drop powder to cause leakage and relatively high production costs, which cannot effectively meet the market's needs for the production and use of aluminum-based copper-clad laminates. A brand-new colloid for aluminum-based copper-clad laminates and its production and preparation process to meet the needs of actual use

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