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Low-formaldehyde adhesive and application thereof to production of solid wood composite floors

An adhesive and low-aldehyde technology, applied in adhesives, aldehyde/ketone condensation polymer adhesives, adhesive types, etc., can solve the problems of low solid content, long production cycle, poor fluidity, etc., and achieve low formaldehyde emission , Formaldehyde emission reduction, the effect of reducing formaldehyde emission

Inactive Publication Date: 2018-10-16
DAYA JIANGSU FLOOR
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are also some problems in the use of soybean gum: due to the large molecular weight, poor permeability, poor fluidity, low solid content, high viscosity, and high curing temperature of soybean gum, it often has long production cycle, low efficiency, high energy consumption and high production in industrial production. High cost limits the application of soybean gum
Moreover, the composite floor uses base materials made of different materials, and there are differences in parameters such as heat transfer coefficient and bonding strength. The use of soybean glue is not conducive to the structural stability of the floor.

Method used

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  • Low-formaldehyde adhesive and application thereof to production of solid wood composite floors

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Experimental program
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Effect test

Embodiment 1

[0040] A low-aldehyde adhesive, which is composed of ingredients GP and ingredients HP, mixed according to the mass ratio of 90-110:15-25, wherein:

[0041] The composition of described batching GP is:

[0042] New 4405 90-100 parts by mass,

[0043] 194C or 5915 20-30 parts by mass,

[0044] 4865 15-25 parts by mass,

[0045] 50-60 parts by mass of water;

[0046] The composition of the ingredient HP is 172C, and the parts by mass are 15-25 parts.

Embodiment 2

[0048] The low aldehyde adhesive that embodiment 1 is made is applied to the production of parquet, comprises the steps:

[0049] A. Prepare the surface board: select ebony wood, saw, sort and process it into sheets, and dry it in a conventional kiln, with a moisture content of 6.5 ± 0.6%;

[0050] B, prepare core board: select fish scale pine for use, routine drying, moisture content reaches 7.5 ± 1.6%;

[0051] C, prepare the backboard: select sylvestris sylvestris for use, utilize conventional kiln drying, make the backboard moisture content be 6.5 ± 1.0%, make the bottom board of required thickness and width through sanding, shearing;

[0052] D, gluing: select the low aldehyde glue that embodiment 1 makes for use, coat adhesive on the gluing surface of well-balanced table board and back board, described ebony wood coating amount 160 ± 5 g / m 2 , coating amount of back plate 140±5 g / m 2 ;

[0053] E. Blank assembly and hot pressing: Arrange the front panel, core panel an...

Embodiment 3

[0061] The surface board is made of three-piece ebony wood, the core board is made of fish-scale pine, and the back board is made of sylvestris pine. The low-aldehyde glue was prepared, and the coating amount of the surface and the back plate were 162 g / m² and 161 g / m², respectively.

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Abstract

The invention belongs to the technical field of adhesives, relates to a low-formaldehyde adhesive and in particular relates to a low-formaldehyde adhesive and an application thereof to production of solid wood composite floors. The low-formaldehyde adhesive is prepared by mixing an ingredient GP and an ingredient HP according to the mass ratio of (90-110):(15-25), wherein the ingredient GP comprises the components in parts by mass: 90-100 parts of new 4405, 20-30 parts of 194C or 5915, 15-25 parts of 4865 and 50-60 parts of water; the ingredient HP comprises the component in parts by mass: 15-25 parts of 172C. The invention further discloses the application of the low-formaldehyde adhesive, and the low-formaldehyde adhesive is adopted in a common solid wood composite floor production process. According to the adhesive disclosed by the invention, the hot-pressing time, hot-pressing pressure, hot-pressing temperature and even the adhesive spreading amount in the original production process are not changed greatly, the problem that it is difficult to realize roller coating due to high viscosity does not exist, the formaldehyde emission amount is reduced, and the adhesion properties are not affected. The formaldehyde emission amounts of the prepared solid wood composite floors are greatly reduced.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and relates to a low-aldehyde adhesive, in particular to a low-aldehyde adhesive and its application in the production of solid wood composite flooring. Background technique [0002] Solid wood flooring is favored by the majority of users for its natural materials, but pure solid wood flooring has problems such as high cost, and cannot be compared with composite flooring in terms of price, and the scope of use is limited. In the industry, solid wood composite flooring usually uses aldehyde-containing adhesives. The aldehyde-containing adhesives have good bonding performance and fast curing, but there are problems such as high formaldehyde emission that affects the health of users. [0003] Soybean glue is an adhesive made from renewable soybeans. Since the raw material does not contain formaldehyde, there is no formaldehyde release when using soybean glue to produce solid wood flooring, which c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J161/24C09J11/04C09J11/06C09J11/08E04F15/04
CPCC09J161/24C09J11/04C09J11/06C09J11/08E04F15/04C08L61/28C08K13/02C08K3/346C08K3/34
Inventor 李金玉李旭阳吴政坚孙厚发周洲束彩霞刘红玲吴慧霞
Owner DAYA JIANGSU FLOOR
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