High-thermal conductivity epoxy resin-based alumina-boron nitride micro-nano composite insulation material

A technology of insulating materials and epoxy resins, applied in the direction of plastic/resin/wax insulators, heat exchange materials, organic insulators, etc., can solve the problem of low thermal conductivity of pure epoxy resins

Inactive Publication Date: 2018-10-23
深圳市圳田科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal conductivity of pure epoxy resin is very low, only about 0.18W / (m K)

Method used

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  • High-thermal conductivity epoxy resin-based alumina-boron nitride micro-nano composite insulation material
  • High-thermal conductivity epoxy resin-based alumina-boron nitride micro-nano composite insulation material
  • High-thermal conductivity epoxy resin-based alumina-boron nitride micro-nano composite insulation material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Example 1: Preparation of high thermal conductivity epoxy resin-based alumina micro-nano composite insulating material

[0028]

[0029] The specific preparation method is as follows:

[0030] 1) Alumina microflakes and boron nitride particles were dried in a drying oven at 80°C for 2 hours, weighed the corresponding amount and mixed evenly, and the epoxy resin was dried in a drying oven at 60°C for 15-30 minutes. reduce the viscosity;

[0031] 2) Weigh the epoxy resin and curing agent with a precision electronic balance, mix and fully stir the mixture, then add the silane coupling agent, and then put the mixture into a planetary vacuum stirring defoaming machine for defoaming treatment;

[0032] 3) Add a homogeneously mixed high thermal conductivity filler system to the mixture in step 2), and add the accelerator after fully stirring again;

[0033] 4) Oscillate the mixture of step 3) in a KQ2200 type ultrasonic cleaner, and after the oscillation, put the mixture ...

Embodiment 2

[0035] Example 2: Preparation of high thermal conductivity epoxy resin-based alumina micro-nano composite insulating material

[0036]

[0037] Embodiment 2 preparation method is the same as embodiment 1.

Embodiment 3

[0038] Example 3: Preparation of high thermal conductivity epoxy resin-based alumina micro-nano composite insulating material

[0039]

[0040]

[0041] The preparation method is the same as in Example 1.

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Abstract

The invention discloses a high-thermal conductivity epoxy resin-based alumina-boron nitride micro-nano composite insulation material. A filler forms a high-thermal conductivity filler system, a fillerbearing ball structure is formed in an epoxy resin matrix, and the material has an excellent thermal conductivity, can meet the heat dissipation requirements of power components, has a stable electrical insulation performance, and can ensure the lasting and safe running of electrical and electronic equipment. A preparation method of the material has the advantages of simple processing process andgood universality, and allows the high-thermal conductivity epoxy resin-based composite insulation material to be easily prepared.

Description

technical field [0001] The invention relates to a high thermal conductivity insulating material, in particular to a method for preparing an epoxy resin-based aluminum oxide-boron nitride micro-nano composite insulating material. The filler constitutes a high thermal conductivity filler system with a bearing ball structure. Background technique [0002] Epoxy resins are widely used in electrical equipment insulation and microelectronic equipment packaging due to their corrosion resistance, excellent adhesion, excellent dielectric properties, and processability. However, the thermal conductivity of pure epoxy resin is very low, only about 0.18W / (m·K). Therefore, in order to improve the heat dissipation capability of high power density electrical and electronic equipment using epoxy resin as insulating material or packaging material, it is necessary to modify epoxy resin to improve its thermal conductivity. Filling the epoxy resin with inorganic thermally conductive fillers of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K9/06C08K7/00C08K3/38C08K5/17C08G59/42C09K5/14H01B3/40
CPCC08K9/06C08G59/4215C08K3/38C08K5/17C08K7/00C08K2003/385C08K2201/003C08K2201/011C08K2201/014C08L2203/20C09K5/14H01B3/40C08L63/00
Inventor 田付强
Owner 深圳市圳田科技有限公司
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