Substrate cleaning solution, preparation method thereof and integrated circuit substrate cleaning method
A technology of integrated circuit base and cleaning liquid, which is applied in the preparation of detergent mixture compositions, circuits, chemical instruments and methods, etc., can solve problems such as damage to integrated circuit substrates and poor cleaning effect, and achieve the effect of strengthening mutual dissolution.
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[0023] The preparation method of the substrate cleaning solution provided in this example is as follows: 5-8 parts of hydrofluoroalcohol, 5-8 parts of ethyl acetate and 5-8 parts of trichloroethylene are dissolved in 20-30 parts of supercritical carbon dioxide solvent to obtain the first a mixture;
[0024] Next, 10-12 parts of ethylene glycol monoethyl ether, 10-15 parts of N-methylpyrrolidone and 10-15 parts of sodium bicarbonate are dissolved in 30-40 parts of deionized water to obtain a second mixed solution;
[0025] The first mixture and the second mixture are mixed.
[0026] The preparation method is simple and easy to operate. By pre-preparing the first mixed solution and the second mixed solution, various components are fully dissolved, which is beneficial to the subsequent cleaning of the integrated circuit substrate, and the obtained substrate cleaning solution can greatly clean the substrate. good cleanliness.
[0027] In addition, an embodiment of the present in...
Embodiment 1
[0038] An embodiment of the present invention provides a method for cleaning an integrated circuit substrate, which includes the following steps:
[0039] S1. Obtain the first mixed solution by dissolving 6 parts of hydrofluoroalcohol, 6 parts of ethyl acetate and 6 parts of trichlorethylene in 25 parts of supercritical carbon dioxide solvent; then 11 parts of ethylene glycol monoethyl ether, N-methyl 13 parts of pyrrolidone and 12 parts of sodium bicarbonate were dissolved in 35 parts of deionized water to obtain a second mixed solution; the first mixed solution and the second mixed solution were mixed to prepare a substrate cleaning agent.
[0040] S2. Firstly, the substrate is soaked in the substrate cleaning solution for 25 minutes. When the substrate is immersed, the ambient pressure is 72.9 atm, and the temperature of the cleaning solution is 40°C.
[0041] S3. Then perform the first ultrasonic cleaning at a frequency of 60 KHz for 12 minutes. The substrate is subjected...
Embodiment 2
[0045] An embodiment of the present invention provides a method for cleaning an integrated circuit substrate, which includes the following steps:
[0046] S1. Obtain the first mixed liquid by dissolving 5 parts of hydrofluoroalcohol, 5 parts of ethyl acetate and 5 parts of trichlorethylene in 20 parts of supercritical carbon dioxide solvent; then 10 parts of ethylene glycol monoethyl ether, N-methyl 10 parts of pyrrolidone and 10 parts of sodium bicarbonate were dissolved in 30 parts of deionized water to obtain a second mixed solution; the first mixed solution and the second mixed solution were mixed to prepare a substrate cleaning agent.
[0047] S2. First, put the substrate in the substrate cleaning solution and soak for 20 minutes. When the substrate is soaking, the ambient pressure is 75atm, and the temperature of the cleaning solution is 35°C.
[0048] S3. Then perform the first ultrasonic cleaning at a frequency of 50 KHz for 15 minutes. The substrate is subjected to t...
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