Forming method for image sensor
A technology of image sensor and pixel array, which is applied in printing image acquisition, instrument, character and pattern recognition, etc., can solve problems such as difficult to improve integration and large module thickness, so as to improve production yield, increase yield, reduce Effect of Yield Loss
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[0032] It can be seen from the background art that the fingerprint imaging module in the prior art has the problem of excessive thickness of the module. Combining with the structure of a fingerprint imaging module, the reason for the excessive thickness of the module is analyzed:
[0033] The optical fingerprint imaging module mainly includes: protective cover, optical sensor, integrated chip (IC), flexible circuit board (FPC) and electronic devices on the flexible circuit board (including light source LED), light guide plate, upper protective shell and Lower protective shell and other main components. Among them, the optical sensor is made on a glass substrate using semiconductor technology such as amorphous silicon thin film transistor (a-Si TFT), low temperature polysilicon thin film transistor (LTPS TFT) or oxide semiconductor thin film transistor (OS TFT); after cutting , dispensing, bonding and other processes to achieve packaging.
[0034] refer to figure 1 , shows a...
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