Depositing nickel layer removing solution and nickel layer removing method for low-temperature chemical nickel bath body

Abstract

The invention discloses a depositing nickel layer removing solution and a nickel layer removing method for a low-temperature chemical nickel bath body. Sulfuric acid, DETA and hydrogen peroxide are dissolved in water, reaction occurs, and according to the total volume of sulfuric acid, diethylenetriamine, the hydrogen peroxide and water, the volume fraction of the sulfuric acid is 3%-6%, the volume fraction of the hydrogen peroxide is 5%-15%, the mass concentration of the DETA is 5 g / L-10 g / L, and the balance is water; the sulfuric acid, the diethylenetriamine and the hydrogen peroxide are commonly used agents in the industry. By adopting the depositing nickel layer removing solution and the nickel layer removing method, the normal-state nickel removing speed of a deplating solution is 240microns / min to 320 microns / min. The rapid removal of a depositing nickel plating layer in low-temperature chemical nickel baths and the like is achieved, and the depositing nickel layer removing solution and the nickel layer removing method are suitable for bath body maintenance during low-temperature small-scale batch chemical nickel production.

Description

technical field [0001] The invention belongs to the field of printed circuits, and in particular relates to a method for depositing a nickel layer stripping solution and a nickel stripping layer on a low-temperature chemical nickel tank. Background technique [0002] Low-temperature electroless nickel plating is widely used in electronic devices such as military three-dimensional packaging modules to achieve interlayer interconnection between module chips. However, there is a self-reaction in low-temperature electroless nickel plating at room temperature, and a thicker nickel layer is gradually deposited in the electroless nickel plating tank, thereby increasing the floating fine nickel particles in the solution. In severe cases, nodules will be formed on the surface of the module after electroless nickel plating , affecting the reliability of the product, resulting in rework or degradation of the product. Therefore, it is necessary to remove the nickel layer deposited in t...

AI Technical Summary

Problems solved by technology

[0003] At present, the method for removing the nickel layer deposited in the low-temperature chemical nickel bath generally adopts the nitric acid with a concentration of 30% to 40%. This method removes the nickel faster, but the removal process will generate toxic yellow-brown NO 2 (Nitrogen dioxide) gas, pollutes the environment, and harms the health of operators. Additional ventilation devices or nitric acid inhibitors must be equipped for removal.