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Au@Cu2O composite hollow micro-particles, preparation method and application

Pending Publication Date: 2018-11-09
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the composite particles of metal-semiconductor heterojunction reported in the literature, such as Au@PbS, Au@ZnS, Au@CdS, Au@Ag 2 S, Au@Cu 2 O, Ag@ZnO, Au@ZnO, etc., these materials are mostly supported on solid particles. Only the surface of this structure can provide active sites for photocatalytic reactions, which greatly restricts the further improvement and utilization of photocatalytic performance.
In "Copper-templated synthesis of gold microcages for sensitive surface-enhanced Raman scattering activity", the inventors of the present invention proposed to replace Au with Cu, but did not prepare cuprous oxide-Au heterostructure at that time, and did not realize that the metal -Technical solution of hollow particles of composite particles of semiconductor heterojunction

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  • Au@Cu2O composite hollow micro-particles, preparation method and application
  • Au@Cu2O composite hollow micro-particles, preparation method and application

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[0025] The following will be combined with Figure 1-4(b) The embodiment of the present invention is described in detail. One embodiment of the present invention is Au@Cu 2 The preparation method of O composite hollow micron particle, comprises the steps:

[0026] Step (1), preparing a hollow Cu shell;

[0027] And, in step (2), add chloroauric acid solution to obtain Au@Cu 2 O composite hollow micron particles.

[0028] Further, in step (1), preparing the hollow Cu shell includes:

[0029] In step (1-1), an alkaline solution is added to a certain concentration of copper salt solution, and then a reducing agent is added to make Cu 2+ reduced to Cu + , to obtain cuprous oxide;

[0030] Step (1-2), the cuprous oxide obtained in step (1) is put into the ethylene glycol solution, and the alkaline solution and the above-mentioned reducing agent are added successively, the cuprous oxide is reduced by the reducing agent, and the Cu + reduced to Cu 0 , to obtain hollow Cu shel...

Embodiment 1

[0042] (1) Add 25ml of sodium hydroxide solution (3.6M) dropwise into 30ml of copper sulfate solution (0.1M), and then add 0.5g of hydroquinone powder after 5 minutes. The entire reaction temperature is kept at 55°C. 2+ reduced to Cu + , reacted for 60 minutes to obtain a 26-hedral cuprous oxide.

[0043] (2) Disperse the cuprous oxide of 26-hedron in 180ml ethylene glycol solution, add 60ml of sodium hydroxide solution (5M), then add 60ml of glucose solution (1.1M), the whole reaction temperature remains at 60°C, and Cu + reduced to Cu 0 , and reacted for 180 minutes to obtain a hollow Cu shell.

[0044] (3) Put the hollow Cu shell into 90ml of aqueous solution containing 0.3g of PVP, add 9ml of chloroauric acid solution (10mM), stir and react at 550rpm at room temperature for 60 minutes at 23°C, centrifuge at 7000rpm for 2 minutes to collect and dry The obtained powder can obtain hexahedron Au@Cu with a hollow structure 2 O composite microparticles.

[0045] The result...

Embodiment 2

[0048] (1) Add 25ml of sodium hydroxide solution (6.8M) dropwise into 30ml of copper sulfate solution (0.1M), and then add 0.5g of hydroquinone powder after 5 minutes. The entire reaction temperature is kept at 55°C. 2+ reduced to Cu + , reacted for 60 minutes to obtain an octahedral cuprous oxide.

[0049] (2) Disperse the octahedral cuprous oxide in 180ml ethylene glycol solution, add 60ml of sodium hydroxide solution (5M), then add 60ml of glucose solution (1.1M), the whole reaction temperature remains at 60°C, and Cu + reduced to Cu 0 , and reacted for 180 minutes to obtain a hollow Cu shell.

[0050] (3) Put the hollow Cu shell into 90ml of aqueous solution containing 0.3g of PVP, add 9ml of chloroauric acid solution (10mM), stir and react at 550rpm at room temperature for 60 minutes at 23°C, centrifuge at 7000rpm for 2 minutes to collect and dry The obtained powder can obtain octahedral Au@Cu with a hollow structure 2 O composite microparticles.

[0051] The result...

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Abstract

The invention relates to Au@Cu2O composite hollow micro-particles, a preparation method and an application. The method comprises the following steps: (1) preparing hollow Cu shells; (2) adding a chloroauric acid solution, thereby obtaining the Au@Cu2O composite hollow micro-particles. The Au@Cu2O composite hollow micro-particles provided by the invention have higher adsorption capacity and more active sites.

Description

technical field [0001] The invention belongs to the technical field of hollow particle materials, in particular to Au@Cu 2 O composite hollow micron particles, preparation method and application. Background technique [0002] In recent years, the use of photocatalytic degradation of organic pollutants in water has become an important research method for water treatment, and semiconductor photocatalysts, as a key issue, have become the focus of research by the majority of scientific researchers. The commonly used semiconductor photocatalysts are titanium dioxide (TiO 2 ), cuprous oxide (Cu 2 O), silver bromide (AgBr), etc. However, for practical application considerations, it is required that the band gap of the semiconductor photocatalyst should not be too large and the toxicity is low. Cuprous oxide (Cu 2 O), as a non-toxic, non-stoichiometric narrow-bandgap semiconductor (bandgap ~2.2eV), has become an important material for photocatalytic degradation of organic pollut...

Claims

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Application Information

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IPC IPC(8): B01J23/52B01J20/06B01J20/30C02F1/30C02F101/30
CPCB01J20/02B01J20/06C02F1/30B01J23/52C02F2101/308B01J2220/42B01J2220/4806B01J35/39
Inventor 孔春才杨志懋马波杨森
Owner XI AN JIAOTONG UNIV
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