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A method for preparing anisotropic thermally conductive bulk materials induced by Gibbs free energy

An anisotropic, thermally conductive block technology, applied in chemical instruments and methods, synthetic resin layered products, layered products, etc., can solve the problems of low thermal conductivity of thermally conductive materials, and achieve high speed, high heat transfer efficiency, and improved thermal conductivity. The effect of heat transfer efficiency

Active Publication Date: 2021-05-04
QINGDAO UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a method for using Gibbs free energy to induce the preparation of anisotropic heat-conducting block materials, and to solve the problem of low thermal conductivity of existing heat-conducting materials

Method used

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  • A method for preparing anisotropic thermally conductive bulk materials induced by Gibbs free energy
  • A method for preparing anisotropic thermally conductive bulk materials induced by Gibbs free energy
  • A method for preparing anisotropic thermally conductive bulk materials induced by Gibbs free energy

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] (1) Take 20g of boron nitride powder as the raw material, and add 1.0g of polyvinylpyrrolidone into 300mL of N-methylpyrrolidone (NMP), and stir for 50min until completely dissolved.

[0029] (3) Take 300g of the mixed solution in step (2) and add it to the grinding equipment with balls, rods or segments as the medium, and grind for 20 hours to obtain oligolayer boron nitride with a concentration of 50mg / mL. See the attached electron transmission photo. figure 1 .

[0030] (4) Take the above 100mL boron nitride dispersion and mix it with the polymer material polypropylene, add sodium dodecylbenzenesulfonate equivalent to the dispersant grade, and stir mechanically for 30 minutes to obtain a two-dimensional nanomaterial dispersion.

[0031] (5) Using the spin centrifugal coating method, uniformly attach a layer of flat liquid film on a substrate with a diameter of 3 cm, place the substrate carrying the flat liquid film under a nitrogen system, and volatilize the solvent ...

Embodiment 2

[0034] (1) Weigh 1g of graphene powder and 1.0g of polyvinyl alcohol into 100mL of N-methylpyrrolidone, stir under ultrasonic waves for 60min until completely dispersed and dissolved.

[0035] (4) The graphene dispersion liquid of above-mentioned 100mL is mixed with macromolecular material polyethylene terephthalate, adds the hexadecyltrimethylammonium bromide of dispersant grade equivalent, mechanically stirs 30min under the ultrasonic wave to obtain two Dimensional nano material graphene dispersion.

[0036] (5) Using the spin centrifugal coating method, uniformly attach a layer of flat liquid film on a substrate with a diameter of 3 cm, place the substrate carrying the flat liquid film under a nitrogen system, and reduce the relative humidity of the solvent in the nitrogen atmosphere to 75%, The solvent in the liquid film is volatilized to gradually solidify it, thereby fixing the ordered structure inside the nano film inside the film.

[0037] (6) Stack the thin film laye...

Embodiment 3

[0039] Cut out each 1*1*0.3cm of the heat-conducting block materials prepared in Examples 1 and 2 2 , using the DZDR-R heat flow method to measure the thermal conductivity respectively, the thermal conductivity of the boron nitride-based thermally conductive block material is 5300W / (m·K), and the thermal conductivity of the graphene-based thermally conductive block material is 4900W / (m· K).

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Abstract

The invention relates to the preparation of heat-conducting materials and belongs to the field of material processing. A method for preparing anisotropic thermally conductive bulk materials by using Gibbs free energy induction, so that the two-dimensional nanomaterials inside the two-dimensional nanomaterial dispersion liquid plane liquid film are oriented, solidified into an anisotropic film, and heated after superposition Press molding to obtain anisotropic heat-conducting bulk material. Internal two-dimensional nanoparticle thermal shock heat transfer is more efficient and faster. Especially when the temperature difference is high, compared with other heat-conducting materials with disordered arrangement of internal nanoparticles, the bulk heat-conducting material prepared by the present invention can reduce the transverse ineffective thermal vibration of two-dimensional nanoparticles at the microscopic level, and improve the longitudinal heat dissipation of nanoparticles. Oscillation frequency improves heat transfer efficiency, and its heat transfer coefficient reaches 5300W / (m·K).

Description

technical field [0001] The invention relates to the preparation of heat-conducting materials, in particular to a method for preparing anisotropic heat-conducting bulk material induced by Gibbs free energy. Background technique [0002] With the development of the information age, integrated electronic equipment has become the material basis of informatization. The integrated circuit integrates millions of logic switches within a centimeter-level space for fast calculations. The unit power density is very high, the conversion rate of electrical energy to heat energy is fast, and the integrated circuit generates a large amount of heat per unit time and heats up rapidly. If the large amount of heat energy generated inside the integrated circuit is not removed in time, its operating efficiency and service life will be greatly reduced, and it may even explode or burn out. [0003] In the prior art, heat-conducting silicon materials are often used for heat dissipation, and the he...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/06B32B27/18B32B27/32B32B27/36B32B37/06B32B37/10C08L23/12C08L67/02C08K3/38C08K3/04C08J5/18
CPCB32B27/08B32B27/18B32B27/32B32B27/36B32B37/06B32B37/10B32B2307/302C08J5/18C08J2323/12C08J2367/02C08K2003/385C08K3/042
Inventor 滕超刘健
Owner QINGDAO UNIV OF SCI & TECH
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