Supercharge Your Innovation With Domain-Expert AI Agents!

Polyhydroxyamide composition and polybenzoxazole resin film for use in manufacturing substrates for electronic devices

A polyhydroxyamide and polybenzoxazole technology, applied in circuit substrate materials, printed circuit components, etc., can solve the problems of poor heat resistance, high toxicity, and high price of silanizing agents, and achieve high heat resistance, line The effect of a small expansion coefficient

Active Publication Date: 2021-09-24
NISSAN CHEM IND LTD
View PDF11 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the price of the silylating agent is high, and hexamethylphosphoric acid triamide is highly toxic, so it lacks industrial applicability
In addition, for copolymerization with polyamic acid, there is a disadvantage of poor heat resistance

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Polyhydroxyamide composition and polybenzoxazole resin film for use in manufacturing substrates for electronic devices
  • Polyhydroxyamide composition and polybenzoxazole resin film for use in manufacturing substrates for electronic devices
  • Polyhydroxyamide composition and polybenzoxazole resin film for use in manufacturing substrates for electronic devices

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0188] [Example 1] Synthesis of polyhydroxyamide P1

[0189] After dissolving HAB1.052g (4.87mmol) in NMP27.6g and adding pyridine 0.963g (12.18mmol), DEDC1.149g (3.90mmol) and TPC0.198g (0.97mmol) were added, and it stirred at room temperature for 24 hours. Then, the obtained solution was poured into 500 mL of pure water. The obtained precipitate was separated by filtration, and then dried under reduced pressure at 70° C. for 24 hours to obtain the target polyhydroxyamide P1. The Mw of the obtained polyhydroxyamide P1 measured by GPC was 60,300, and the Mw / Mn was 2.8.

Embodiment 2、 comparative example 1～5

[0190] [Example 2, Comparative Examples 1-5] Synthesis of Polyhydroxyamide P2, Polyhydroxyamide CP1-CP5

[0191] Polyhydroxyamide P2 and polyhydroxyamides CP1 to CP5 were synthesized in the same manner as in Example 1. Table 1 shows the type and amount of dicarboxylic acid chloride used, the type and amount of diamine used, the amount of NMP used, Mw, and Mw / Mn.

[0192] [2] Evaluation of the solubility of polyhydroxyamide

[0193] 1 g of the prepared polyhydroxyamide was put into 20 g of NMP, and stirred at room temperature for 48 hours to redissolve it.

[0194] The results are shown in Table 1 together. In addition, the evaluation criteria of solubility are as follows.

[0195] ◯: Dissolved during polymerization and redissolved after purification.

[0196] Δ: Dissolved during polymerization, but not redissolved after purification.

[0197] ×: Precipitated during polymerization.

[0198] [Table 1]

[0199]

[0200] [2] Production and evaluation of polybenzoxazole r...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides a polyhydroxyamide composition for producing a substrate for an electronic device, comprising: (A) a polyhydroxyamide containing a unit represented by formula (1) and a unit represented by formula (2), and (B) Organic solvents. In formula (1) and formula (2), X 1 Represents a biphenylene with a hydroxyl group on the carbon atom adjacent to the carbon atom bonded to the nitrogen atom; Y 1 Represents a divalent aromatic group with 6 to 14 carbon atoms; Y 2 represents a group represented by formula (3); n and m represent positive numbers satisfying 0<n<100, 0<m<100 and 0<n+m≦100. In formula (3), Z 1 Indicates ‑O‑, ‑NH‑ or ‑N(R)‑, R represents an alkyl group with 1 to 10 carbons; Ar 1 and Ar 2 Each independently represents a divalent aromatic group having 6 to 14 carbon atoms; a dotted line represents a bonding terminal.

Description

technical field [0001] The present invention relates to a polyhydroxyamide composition used for producing a substrate for electronic devices and a polybenzoxazole resin film obtained from the composition. Background technique [0002] In recent years, with the development of miniaturization and high performance of electronic equipment, characteristics such as light weight and heat resistance are also required for components used in electronic equipment. Especially in the field of organic electroluminescent (EL) displays, not only glass members sometimes account for more than half of the weight of the equipment, but also the market expects increasingly high expectations for flexible displays. Therefore, new flexible products that replace glass are required. The urgency of the material is strong. [0003] Glass is used as a member of electronic devices due to its excellent heat resistance and low coefficient of linear expansion. Therefore, excellent heat resistance and low c...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08L77/10C08G69/32C08G73/22C08J5/18H05K1/03
CPCC08J5/18C08G69/32C08G73/22C08L77/10H05K1/03C08L79/04
Inventor 进藤和也江原和也
Owner NISSAN CHEM IND LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com