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Organic encapsulating slurry used for chip resistors and capable of being stored at a normal temperature, and preparation method thereof

A technology of encapsulating slurry and chip, applied in resistors, non-adjustable metal resistors, circuits, etc., can solve the problems of high storage conditions, high storage costs, and slurry failure, and achieves good solubility and film. Excellent layer density and improved adhesion

Inactive Publication Date: 2018-11-30
西安英诺维特新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the existing encapsulation slurry needs to be equipped with special refrigeration equipment during storage, which has high requirements for the storage environment and storage conditions, which in turn leads to high storage costs. If the temperature changes, the slurry will fail and cannot be used.

Method used

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  • Organic encapsulating slurry used for chip resistors and capable of being stored at a normal temperature, and preparation method thereof
  • Organic encapsulating slurry used for chip resistors and capable of being stored at a normal temperature, and preparation method thereof
  • Organic encapsulating slurry used for chip resistors and capable of being stored at a normal temperature, and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] An organic encapsulation slurry for chip resistors suitable for storage at room temperature according to Example 1 of the present invention is made of the following raw materials in percentage by weight: 8% black pigment, 20% ultrafine silicon oxide, 15% ultrafine oxide Aluminum, 1% adhesion promoter, 0.5% defoamer, 0.5% leveling agent, 25% first organic vehicle, first organic vehicle consists of 85% butyl carbitol acetate and 15% modified epoxy resin Made, 30% of the second organic vehicle, the second organic vehicle is made of 28% terpineol, 22% butyl carbitol acetate and 50% o-cresol modified epoxy resin.

[0019] The preparation method of the first organic carrier is as follows: Weigh the formulated amount of butyl carbitol acetate and modified epoxy resin into a glass container, heat to 70° C. in a water bath environment, stir, and mix for 70 minutes. After mixing evenly, cool and stand still, and the dissolved product becomes a light yellow translucent viscous liq...

Embodiment 2

[0023] An organic encapsulation slurry for chip resistors suitable for storage at room temperature according to Example 1 of the present invention is made of the following raw materials in percentage by weight: 8% black pigment, 15% ultrafine silicon oxide, 20% ultrafine silicon oxide Aluminum, 2% adhesion promoter, 0.5% defoamer, 1% leveling agent, 25% first organic vehicle, first organic vehicle consists of 85% butyl carbitol acetate and 15% modified epoxy resin Made, 28.5% of the second organic vehicle, the second organic vehicle is made of 28% terpineol, 22% butyl carbitol acetate and 50% o-cresol modified epoxy resin.

[0024] The preparation method of the first organic carrier is as follows: Weigh the formulated amount of butyl carbitol acetate and modified epoxy resin into a glass container, heat to 80° C. in a water bath environment, stir, and mix for 80 minutes. After mixing evenly, cool and stand still, and the dissolved product becomes a light yellow translucent vis...

Embodiment 3

[0028] An organic encapsulation paste for chip resistors suitable for storage at room temperature according to Example 1 of the present invention is made of the following raw materials in percentage by weight: 8% black pigment, 20% ultrafine silicon oxide, 20% ultrafine oxide Aluminum, 4% adhesion promoter, 1% defoamer, 0.5% leveling agent, 26.5% first organic vehicle, first organic vehicle consists of 85% butyl carbitol acetate and 15% modified epoxy resin Made, 20% of the second organic vehicle, the second organic vehicle is made of 28% terpineol, 22% butyl carbitol acetate and 50% o-cresol modified epoxy resin.

[0029] The preparation method of the first organic carrier is as follows: Weigh the butyl carbitol acetate and the modified epoxy resin in the formula amount, place them in a glass container, heat to 60°C in a water bath environment, stir, and mix for 60 minutes. After mixing evenly, cool and stand still, and the dissolved product becomes a light yellow translucent...

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Abstract

The invention relates to an organic encapsulating slurry used for chip resistors and capable of being stored at a normal temperature, and a preparation method thereof, wherein the organic encapsulating slurry is prepared from the following raw materials by weight: 5-10% of a black pigment, 10-20% of ultrafine silica, 10-20% of ultrafine alumina, 1-5% of an adhesion promoter, 0.5-1% of a defoamer,0.5-1% of a leveling agent, 20-40% of a first organic carrier, and 30-40% of a second organic carrier. According to the present invention, by adding the adhesion prompter to the raw materials, the adhesion of the slurry can be improved; the modified resin has good solubility in the commonly used low volatile solvents so as to improve the performance of the slurry, wherein the adhesion of the curedfilm and the wet-heat resistance are good; by adding the low volatile solvent to the raw materials, the obtained product is suitable for the storage at the room temperature compared to the conventional organic encapsulating slurry using the solvent while the conventional performance of the product of the present invention is not significantly different from the conventional slurry, wherein the temperature resistance is excellent; and after the slurry of the present invention is cured, the density of the film layer is remarkably excellent.

Description

technical field [0001] The invention relates to the technical field of electrical components, in particular to an organic encapsulating paste for chip resistors suitable for normal temperature storage. Background technique [0002] The encapsulation layer protects the core functional layer of the chip resistor—the resistance layer. Therefore, the performance of the encapsulation paste plays a key role in the stability of the chip resistor component. Existing encapsulation slurries are stored at low temperature, and the storage temperature is generally below 0°C, mainly because the organic carrier used to prepare the slurries volatilizes quickly at room temperature. Therefore, the existing encapsulation slurry needs to be equipped with special refrigeration equipment during storage, which has high requirements for the storage environment and storage conditions, which in turn leads to high storage costs. If the temperature changes, the slurry will become invalid and unusable. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K13/02C08K3/36C08K3/22C08K5/101C08K5/05H01C7/00
CPCC08K2003/2227C08L63/00C08L2203/206C08L2205/025H01C7/00C08K13/02C08K3/36C08K3/22C08K5/101C08K5/05
Inventor 于浩邢杰
Owner 西安英诺维特新材料有限公司