Multilayer anisotropic conductive cloth adhesive tape, and manufacturing method thereof

Abstract

The invention discloses a multilayer anisotropic conductive cloth adhesive tape. The multilayer anisotropic conductive cloth adhesive tape comprises an upper conductive adhesive layer, a conductive cloth layer, and a lower conductive adhesive layer; the conductive cloth layer is arranged between the upper conductive adhesive layer and the lower conductive adhesive layer; one or two surfaces selected from the upper surface and the lower surface of the conductive cloth layer are coated with a metal layer through plating; the total thickness of the upper conductive adhesive layer, the conductivecloth layer, and the lower conductive adhesive layer ranges from 40 to 60 <mu>m. The multilayer anisotropic conductive cloth adhesive tape is excellent in electrical characteristics, high in bonding strength, excellent in solderability, reliability, and flame resistance; compared with common conductive adhesive, advantages are that: the conductivity and the bonding strength are excellent, production is convenient, and market prospect is promising. The multilayer anisotropic conductive cloth adhesive tape is mainly used in FPC, and reinforced parts composed of FPC with steel sheets or PI (polyimide) type reinforcing plate through laminating, and is capable of avoiding installation part deformation caused by bending, ensuring excellent product pore filling performance, and realizing direct ground connection and external signal interference shielding effect.

Description

technical field [0001] The invention belongs to the technical field of conductive cloth glue for printed circuit boards, in particular to a multilayer anisotropic conductive cloth glue. Background technique [0002] The development trend of electronic and communication products requires circuit substrate components to develop towards light, thin, small and highly integrated, and the frequency band of transmission signals is getting wider and wider, resulting in more and more serious electromagnetic interference; at the same time, considering the safety of electronic circuit components, the electronic The grounding reliability of circuit components in the product and the degree of freedom of circuit board design have put forward new requirements. At present, the conductive adhesive products commonly used in the market may appear due to the conductive adhesive filling the ground aperture too full, affecting the design and installation of other components or not filling enough. ...

AI Technical Summary

Problems solved by technology

[0002] The development trend of electronic and communication products requires circuit substrate components to develop towards light, thin, small and highly integrated, and the frequency band of transmission signals is getting wider and wider, resulting in more and more serious electromagnetic interference; at the same time, considering the safety of electronic circuit components, the electronic The grounding reliability of circuit components in the product and the degree of freedom of circuit board design have put forward new requirements. At present, the conductive adhesive products commonly used in the market may appear due to the conductive adhesive filling the ground aperture too full, affecting the design and installation of other components or not filling enough. During reflow soldering, there are gaps in the connection part and there are defects such as explosion boards

[0003] In addition, most of the conductive adhesive products currently in the market directly disperse conductive particles in the adhesive. The adhesive layer is generally thick. If the curing is not sufficient and the pressing conditions are uneven, it will cause the product to be stuck to the printed circuit board. Uneven powder distribution occurs, which affects the conduction performance, etc.

[0004] At present, there are also some new technologies and patents mentioning that the thin metal layer is buried in the conductive adhesive layer to improve the conductivity of the conductive adhesive product, and reduce the powder content to reduce the cost. The theory is completely established, but in the actual production process due to metal The flexibility itself is not good, and the hole filling performance of the product after lamination cannot achieve the expected effect, and it may be worse. At the same time, the metal layer has poor air permeability. In the FPC (flexible circuit board), SMT (surface mount) technology) there will be hidden dangers of explosion

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