Anisotropic conductive adhesive

An anisotropic conductive and adhesive technology, applied in the direction of conductive adhesives, adhesives, electrical components, etc., can solve the problems of uneven powder distribution and affecting conduction performance, achieve high bonding strength and improve conduction performance, the effect of good ground stability

Inactive Publication Date: 2021-06-11
HUIZHOU HAOMING SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The adhesive layer is generally thick, if the curing is insufficient and the lamination conditions are uneven, it will lead to uneven powder distribution when the product is attached to the printed circuit board, which will affect the conduction performance, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] An anisotropic conductive adhesive provided in this embodiment includes component A and component B.

[0029] Among them, component A includes adhesive resin, leveling agent, leveling agent, defoamer, coupling agent, and solid material. Among them, the adhesive resin is bisphenol A epoxy resin, the leveling agent is propylene glycol methyl ether acetate, the defoamer is polydimethylsiloxane, the diluent is volatile siloxane, and the coupling agent is γ - Aminopropyltriethoxysilane. In component A, the proportion of bisphenol A type epoxy resin is 30% (weight ratio), the proportion of solid material is 20% (weight ratio), and the proportion of propylene glycol methyl ether acetate is 1% (weight ratio) , the proportion of polydimethylsiloxane is 1% (weight ratio), the proportion of volatile siloxane is 5% (weight ratio), and the rest is γ-aminopropyltriethoxysilane.

[0030] B component is glue curing agent. The curing agent is made by mixing aromatic isocyanate curing...

Embodiment 2

[0034] An anisotropic conductive adhesive provided in this embodiment includes component A and component B.

[0035]Among them, component A includes adhesive resin, leveling agent, leveling agent, defoamer, coupling agent, and solid material. Among them, the adhesive resin is bisphenol A epoxy resin, the leveling agent is propylene glycol methyl ether acetate, the defoamer is polydimethylsiloxane, the diluent is volatile siloxane, and the coupling agent is γ - Glycidyl ether propyltriethoxysilane. In component A, the proportion of bisphenol A type epoxy resin is 60% (weight ratio), the proportion of solid material is 25% (weight ratio), and the proportion of propylene glycol methyl ether acetate is 1% (weight ratio) , the proportion of polydimethylsiloxane is 1% (weight ratio), the proportion of volatile siloxane is 5% (weight ratio), and the rest is γ-glycidyl ether propyl triethoxysilane.

[0036] B component is glue curing agent. The curing agent is made by mixing aromat...

Embodiment 3

[0039] An anisotropic conductive adhesive provided in this embodiment includes component A and component B.

[0040] Among them, component A includes adhesive resin, leveling agent, leveling agent, defoamer, coupling agent, and solid material. Among them, the adhesive resin is bisphenol A epoxy resin, the leveling agent is propylene glycol methyl ether acetate, the defoamer is polydimethylsiloxane, the diluent is volatile siloxane, and the coupling agent is γ -Propyltrimethylsilane. In component A, the proportion of bisphenol A type epoxy resin is 40% (weight ratio), the proportion of solid material is 30% (weight ratio), and the proportion of propylene glycol methyl ether acetate is 5% (weight ratio) , the proportion of polydimethylsiloxane is 5% (weight ratio), the proportion of volatile siloxane is 10% (weight ratio), and the rest is γ-propyltrimethylsilane.

[0041] B component is glue curing agent. The curing agent is made by mixing aromatic isocyanate curing agent, tr...

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Abstract

The invention relates to an anisotropic conductive adhesive which comprises a component A and a component B. The component B is an adhesive curing agent. The component A comprises bisphenol A type epoxy resin, volatile siloxane, propylene glycol methyl ether acetate, polydimethylsiloxane, a coupling agent and a solid material; the weight ratio of the bisphenol A epoxy resin in the component A is 30-60%, and the weight ratio of the solid material in the component A is 20-30%. The coupling agent is at least one of [gamma]-aminopropyl triethoxy silane, [gamma]-glycidyl ether propyl triethoxy silane and [gamma]-propyl trimethylsilane. The solid material comprises a graphite material, a silicon material and a metal material, the weight ratio of the graphite material in the solid material is a, the weight ratio of the silicon material in the solid material is b, the weight ratio of the metal material in the solid material is c, and a+b+c=1, a<=b<c, 0.4<=c<=a+b.

Description

technical field [0001] The invention relates to the field of electronic connectors, in particular to an anisotropic conductive adhesive. Background technique [0002] Anisotropic conductive adhesive is usually used as an electronic connector in printed circuit boards. Anisotropic conductive adhesive can play the role of conductive connection and electromagnetic shielding. Most of the current commercialized conductive adhesive products directly disperse the conductive particles in the adhesive, and the adhesive is mainly a polymer compound containing π bonds, such as polyacetylene, polythiophene, polyaniline, polystyrene vinylene, etc. The adhesive layer is generally thick. If the curing is insufficient and the lamination conditions are uneven, it will lead to uneven powder distribution when the product is attached to the printed circuit board, which will affect the conduction performance. Contents of the invention [0003] Aiming at the technical problems existing in the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J9/02C09J11/04C09J11/06C09J11/08C08G59/40H05K9/00
CPCC09J163/00C09J9/02C09J11/04C09J11/06C09J11/08C08G59/4028H05K9/0081C08K2003/023C08K2003/0806C08K2003/0812C08K2003/0856C08K2003/085C08K2003/2265C08K2003/2286C08K2003/2227C08K2003/2231C08K2003/2248
Inventor 蒋友兵何振梅
Owner HUIZHOU HAOMING SCI & TECH
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