Substrate structure of semiconductor diode chip and production process thereof
A production process and diode technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of reducing the service life of the substrate, poor heat transmission, uneven packaging effect, etc. the effect of increasing
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 2
[0064] Such as Figure 10 As shown, the present invention also provides a semiconductor diode chip packaging manufacturing method, comprising the following steps:
[0065] S100, welding the metal heat sink to the package bracket, and fixing the chip position.
[0066] S200. The packaging bracket with the chip installed is sent to the reflow furnace for reflow soldering. During the reflow soldering, the temperature in the reflow furnace rises rapidly to the preheating temperature, and then continues to heat up to the melting temperature of the solder to produce a melting reaction. Finally, the temperature is rapidly lowered. .
[0067] S300. Connect the positive and negative poles of the chip with the metal pins on the package support, and weld the metal pins on the package support.
[0068] S400, dispensing the hemispherical silica gel on the surface of the chip, and installing the overall connection structure of the reflective cup and the negative lens.
[0069] Wherein st...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com