Supercharge Your Innovation With Domain-Expert AI Agents!

An additive and process for manufacturing 5-micron high-tensile copper foil

An additive and high tensile technology, applied in electroforming, electrolysis process, etc., can solve the problems of high production cost of electrolytic copper foil, coarse and loose crystal structure, poor uniformity of coating thickness, etc., and achieve low double-sided roughness and short reaction time Short, low-cost effect

Active Publication Date: 2020-09-29
惠州联合铜箔电子材料有限公司
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Because the inorganic additives containing arsenic and antimony are harmful to human body and environment, and the price of such metals is high, the production cost of electrolytic copper foil is high.
Among the currently used organic additives, the prepared copper foil has the problems of poor uniformity of coating thickness, coarse and loose crystal structure and low tensile strength, and the existing technology can only achieve 10 microns or less, which is not very good. Fully meet the application of high-end circuit boards and large-capacity lithium batteries

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] An additive for the manufacture of 5-micron high-tensile copper foil, specifically adding: 400 mg of gelatin, 100 mg of hydroxyethyl cellulose, 100 mg of polyethylene glycol, 200 mg of sodium chloride, and phenyl poly Sodium dithiopropane sulfonate 30 mg, polyoxyethylene polyoxypropylene block compound 30 mg.

[0034] Before adding the copper sulfate electrolyte, hydroxyethyl cellulose and polyethylene glycol are a mixed aqueous solution with a mass ratio of 1:1. Before adding the copper sulfate electrolyte, the sodium phenyl polydithiopropane sulfonate and the polyoxyethylene polyoxypropylene block compound are a mixed solution with a mass ratio of 1:1. In copper sulfate electrolyte, Cu 2+ The concentration is 100g / L, H 2 SO 4 The concentration is 110g / L; the temperature of the electrolyte is controlled at 50°C. The flow rate of the additive is controlled at 40mL / min.

[0035] Using the above-mentioned additives to produce 5 micron high-tensile copper foil, the sp...

Embodiment 2

[0042] An additive for the manufacture of 5-micron high-tensile copper foil, specifically adding: 100 mg of gelatin, 50 mg of hydroxyethyl cellulose, 50 mg of polyethylene glycol, 70 mg of sodium chloride, and phenylpolyethylene per 1 L of copper sulfate electrolyte Sodium dithiopropane sulfonate 10 mg, polyoxyethylene polyoxypropylene block compound 10 mg.

[0043] Before adding the copper sulfate electrolyte, hydroxyethyl cellulose and polyethylene glycol are a mixed aqueous solution with a mass ratio of 1:1. Before adding the copper sulfate electrolyte, the sodium phenyl polydithiopropane sulfonate and the polyoxyethylene polyoxypropylene block compound are a mixed solution with a mass ratio of 1:1. In copper sulfate electrolyte, Cu 2+ Concentration is 90g / L, H 2 SO 4 The concentration is 100g / L; the temperature of the electrolyte is controlled at 45°C. The flow rate of the additive is controlled at 40mL / min.

[0044] Using the above-mentioned additives to produce 5 mi...

Embodiment 3

[0051] An additive for the manufacture of 5-micron high-tensile copper foil, specifically adding: 600 mg of gelatin, 300 mg of hydroxyethyl cellulose, 300 mg of polyethylene glycol, 300 mg of sodium chloride, and phenyl poly Sodium dithiopropane sulfonate 50 mg, polyoxyethylene polyoxypropylene block compound 50 mg.

[0052] Before adding the copper sulfate electrolyte, hydroxyethyl cellulose and polyethylene glycol are a mixed aqueous solution with a mass ratio of 1:1. Before adding the copper sulfate electrolyte, the sodium phenyl polydithiopropane sulfonate and the polyoxyethylene polyoxypropylene block compound are a mixed solution with a mass ratio of 1:1. In copper sulfate electrolyte, Cu 2+ Concentration is 105g / L, H 2 SO 4 The concentration is 110g / L; the temperature of the electrolyte is controlled at 50°C. The flow rate of the additive is controlled at 40mL / min.

[0053] Using the above-mentioned additives to produce 5 micron high-tensile copper foil, the specif...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
tensile strengthaaaaaaaaaa
tensile strengthaaaaaaaaaa
surface roughnessaaaaaaaaaa
Login to View More

Abstract

The invention provides an additive for manufacturing 5-micron high-tensile copper foil. According to the additive, 100-600 mg of gelatin, 50-300 mg of hydroxyethyl cellulose, 50-300 mg of polyethyleneglycol, 50-500 mg of sodium chloride, 10-50 mg of 3,3'-dithiobis-1-propanesulfonic acid disodium salt and 10-50 mg of polyox-yethylene-polyoxypropylene block compound are added into each 1 L of copper sulfate electrolyte. The additive for manufacturing the 5-micron high-tensile copper foil is an organic additive, the components are optimized, so that when the additive is applied in the productionprocess of the copper foil, the thickness uniformity of the manufactured electrolytic copper foil is good, and high elongation rate and high tensile strength are achieved. The invention further provides a technology for producing the 5-micron high-tensile copper foil by adopting the additive.

Description

technical field [0001] The invention relates to the technical field of electrolytic copper foil manufacturing, in particular to an additive and a process for manufacturing 5-micron high-tensile copper foil. Background technique [0002] As the electronic basic material of printed circuit board PCB and lithium battery negative electrode material, the tensile strength, elongation, compactness, surface roughness, thickness uniformity and appearance quality of electrolytic copper foil will affect the electrochemical performance of electronic products. In the production process of electrolytic copper foil, additives have a great influence on its appearance and structure. [0003] The additives currently used in the production of electrolytic copper foil include: inorganic additives, such as inorganic additives containing arsenic and antimony, which are used to increase cathode polarization and inhibit abnormal growth of metals to improve the elasticity, strength, hardness and smo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C25D1/04C25D3/38
CPCC25D1/04C25D3/38
Inventor 周启伦
Owner 惠州联合铜箔电子材料有限公司
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com