Negative pressure controllable atmosphere welding system

Abstract

The invention discloses a negative pressure controllable atmosphere welding system. The negative pressure controllable atmosphere welding system comprises a preheating table, a welding device, a cooling table and a program control system, wherein the preheating table is used for preheating to-be-welded products, and the welding device is used for welding the to-be-welded products; the cooling table is used for cooling the welded finished products; the program control system is used for controlling the welding device to draw negative pressure and introduce inert gas; and the welding device is connected with the program control system. The preheating table, the welding device and the cooling table are independently arranged, and the welding device can be quickly opened and closed according to use requirements, so that the welded process products can be rapidly switched between the preheating table, the welding device and the cooling table, the problems that in the prior art, because thepreheating table, the welding device and the cooling table are arranged into a whole, the cooling rate is low and the welding time is long are solved; and therefore, the negative-pressure controllableatmosphere welding system can achieve low-hole-rate welding of the products under the condition that the welding time is not remarkably increased, and the welding requirement of the products is met when the welding time is met.

Description

technical field [0001] The invention relates to the technical field of packaging of electronic products, in particular to a negative pressure controllable atmosphere welding system. Background technique [0002] In the field of electronic product packaging, the components and chips in the product are mainly assembled on the surface of the substrate by welding. The solder joints with low void rate have high welding strength and good electrical conductivity and heat transfer performance. Therefore, reducing the solder void rate of the product improves product performance. and the key to reliability. [0003] In order to achieve low void rate welding, it is an effective way to vacuumize the product during the welding process. The vacuum controllable atmosphere welding furnace of the prior art can vacuumize the void during the product welding process, and the void of the welded product The heat source in the vacuum controllable atmosphere reflow furnace is an infrared lamp, whi...

AI Technical Summary

Problems solved by technology

[0003] In order to achieve low void rate welding, it is an effective way to vacuumize the product during the welding process. The vacuum controllable atmosphere welding furnace of the prior art can vacuumize the void during the product welding process, and the void of the welded product The heat source in the vacuum controllable atmosphere reflow furnace is an infrared lamp, which heats the graphite plate on which the product is placed through the radiation of the lamp. After the product is welded, the furnace cavity is cooled by inert gas (or water cooling). Since the furnace chamber heats up and down according to the program settings after putting the product in, the maximum temperature rise and fall rate that the furnace chamber can achieve is low. The welding process usually has many problems such as long welding melting time and slow cooling and crystallization. Therefore, the vacuum can Controlled atmosphere reflow furnaces are suitable for a limited variety of products, and are mainly suitable for applications where the melting point of the solder is relatively high and the melting time of the solder is long. For example, in the packaging industry of integrated circuits and semiconductor discrete devices, it is used between the chip and the base of the package shell eutectic soldering

Images