Shape follow-up compacting method for thermal-insulation pad
An insulating pad and conformal technology, which is applied in the field of conformal pressing of heat insulating pads, can solve the problem of waste of raw materials in the processing of heat insulating pads, and achieve the effects of saving raw material costs, material costs, and solid waste treatment costs.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0022] The present invention will be further described below in conjunction with the accompanying drawings. The following examples are only used to illustrate the technical solution of the present invention more clearly, but not to limit the protection scope of the present invention.
[0023] Such as figure 1 Shown: This embodiment discloses a method for conformal pressing of heat insulation pads, and now uses five layers (the number of layers after the product is formed is five) as an example for introduction, other layers can also refer to this embodiment.
[0024] First of all, the sheet material is cut, and the multi-layer material to be processed (including the surface layer 1, the middle layer 3, the fourth layer 4 and the bottom layer 5) is respectively cut into sheets of specified size; the sheet material of this embodiment includes EPDM (ethylene propylene rubber) A), EVA (vinyl acetate copolymer), PP (polypropylene), PU (polyurethane) board and glass wool.
[0025]...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com