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A kind of LED encapsulating silica gel with excellent bonding performance and preparation method thereof

A technology for LED packaging and bonding performance, applied in adhesives, polymer adhesive additives, semiconductor devices, etc., can solve problems such as poor bonding, achieve the effects of reducing viscosity, improving toughness, and ensuring barrier properties

Active Publication Date: 2021-02-09
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention aims at the current situation of poor cohesiveness of the existing LED encapsulation adhesives based on organosilicon materials, and provides an LED encapsulation silica gel with excellent adhesive properties and a preparation method thereof

Method used

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  • A kind of LED encapsulating silica gel with excellent bonding performance and preparation method thereof
  • A kind of LED encapsulating silica gel with excellent bonding performance and preparation method thereof
  • A kind of LED encapsulating silica gel with excellent bonding performance and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] A kind of LED encapsulating silica gel, comprising A component and B component, the mass ratio of the two is (1-5): 1; wherein, by weight parts, the A component includes: the molecular formula is (ViMeSiO 0.5 ) 0.45 (MeSiO) 0.18 (ViMeSiO) 0.21 (ViMeSiO1.5) 0.16 55 grams of methyl vinyl MDT silicone resin, the structural formula is (ViMeSiO 0.5 ) 15 (MeSiO 0.5 ) 25 40 grams of methyl vinyl silicone oil, 0.5 grams of ethanol solution of chloroplatinic acid with a platinum content of 4000 ppm, 4.5 grams of tackifier (n=100~500) shown in structural formula 1;

[0033] Described B component comprises: Molecular formula is (ViMeSiO 0.5 ) 0.45 (MeSiO) 0.18 (ViMeSiO) 0.21 (ViMeSiO1.5) 0.16 50 grams of methyl vinyl MDT silicone resin, the structural formula is (ViMeSiO 0.5 ) 15 (MeSiO 0.5 ) 25 45 grams of methyl vinyl silicone oil, 5 grams of methyl hydrogen-containing silicone oil with a hydrogen content of 1.5 wt%, and 0.3 grams of inhibitor ethynyl cyclohexanol...

Embodiment 2

[0035] A kind of LED encapsulating silica gel, comprising A component and B component, the mass ratio of the two is (1-5): 1; wherein, by weight parts, the A component includes: the molecular formula is (ViMeSiO 0.5 ) 0.17 (MeSiO) 0.31 (ViMeSiO) 0.37 (ViMeSiO1.5) 0.15 50 grams of methyl vinyl MDT silicone resin, the structural formula is (ViMeSiO 0.5 ) 23 (MeSiO 0.5 ) 14 45 grams of methyl vinyl silicone oil, 0.1 grams of platinum-vinyl siloxane complex with a platinum content of 2000 ppm, and 6 grams of tackifier (n=100-500) shown in structural formula 2;

[0036] Described B component comprises: Molecular formula is (ViMeSiO 0.5 ) 0.17 (MeSiO) 0.31 (ViMeSiO) 0.37 (ViMeSiO1.5) 0.15 55 grams of methyl vinyl MDT silicone resin, the structural formula is (ViMeSiO 0.5 ) 23 (MeSiO 0.5 ) 14 40 grams of methyl vinyl silicone oil, 3 grams of methyl hydrogen silicone oil with a hydrogen content of 1 wt%, and 0.4 grams of inhibitor 1,1,3-triphenyl-2-propyn-1-ol.

Embodiment 3

[0038] A kind of LED encapsulating silica gel, comprising A component and B component, the mass ratio of the two is (1-5): 1; wherein, by weight parts, the A component includes: the molecular formula is (ViMeSiO 0.5 ) 0.17 (MeSiO) 0.55 (ViMeSiO) 0.13 (ViMeSiO1.5) 0.15 45 grams of methyl vinyl MDT silicone resin, the structural formula is (ViMeSiO 0.5 ) 15 (MeSiO 0.5 ) 54 25 grams of methyl vinyl silicone oil, 0.3 grams of a platinum olefin complex with a platinum content of 6000 ppm, and 2 grams of a tackifier (n=500 to 1000) shown in structural formula 1;

[0039] Described B component comprises: Molecular formula is (ViMeSiO 0.5 )0.17 (MeSiO) 0.55 (ViMeSiO) 0.13 (ViMeSiO1.5) 0.15 45 grams of methyl vinyl MDT silicone resin, the structural formula is (ViMeSiO 0.5 ) 15 (MeSiO 0.5 ) 54 50 grams of methyl vinyl silicone oil, 2 grams of low-hydrogen silicone oil, and 0.2 grams of inhibitor ethynyl cyclohexanol.

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PUM

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Abstract

The invention relates to an LED packaging silica gel with excellent bonding performance and a preparation method thereof, comprising component A and component B, the mass ratio of which is (1-5): 1; Components include: 45-55 parts of methyl vinyl MDT silicone resin, 25-45 parts of methyl vinyl silicone oil, 0.1-0.5 parts of platinum catalyst, 2-6 parts of tackifier; component B includes: methyl vinyl 45-55 parts of MDT silicone resin, 26-50 parts of methyl vinyl silicone oil, 1-5 parts of crosslinking agent, and 0.2-0.4 parts of inhibitor; the specific structure of the tackifier is shown in structural formula 1 or structural formula 2. The encapsulating silica gel of the present invention adopts a tackifier with a specific structure. The addition of the tackifier greatly improves the adhesion of the silica gel to the substrate. The addition of methyl vinyl silicone oil provides vinyl groups that can participate in the reaction and reduces the viscosity of the system. The viscosity improves the toughness of the system.

Description

technical field [0001] The invention relates to LED packaging silica gel, in particular to LED packaging silica gel with excellent bonding performance and a preparation method thereof, belonging to the technical field of adhesives. Background technique [0002] Light-emitting diode (LED) is a semiconductor component that can emit light. Compared with conventional lighting equipment, it has many advantages, such as energy saving, environmental protection and long service life. It is called "green lighting". As a new type of Solid light sources have great application prospects in the fields of lighting and display. With the improvement of the government and the public's awareness of energy conservation and environmental protection and the advancement of technology, LEDs are increasingly used in general lighting applications, including landscape lighting, traffic lights, interior decoration lights, miner's lamps, navigation lights, and automotive LED lights And indoor LED deco...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/07C09J11/08H01L33/56
CPCC08L2203/206C08L2205/025C08L2205/035C09J11/08C09J183/04H01L33/56C08L83/04C08L83/00
Inventor 王亚婷陈维
Owner YANTAI DARBOND TECH