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A kind of corrosion-resistant bonding copper wire and preparation method thereof

A technology for bonding copper wires and corrosion resistance, which is applied in circuits, electrical solid state devices, semiconductor devices, etc., and can solve problems such as poor anti-oxidation and anti-acidification performance, reduced service life of bonding copper wires, and peeling off of protective layers. Achieve better protection effect, improve service life and strong anti-corrosion performance

Active Publication Date: 2020-05-15
WUHU CHANGRUN SPECIAL COPPER
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the deficiencies of the prior art, the present invention provides a corrosion-resistant bonding copper wire and a preparation method thereof, which solves the problem that the existing bonding copper wire is worn out after long-term use, causing the protective layer to fall off, and the performance of anti-oxidation and anti-acidification changes. Poor, leading to the problem that the service life of the bonding copper wire is reduced

Method used

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  • A kind of corrosion-resistant bonding copper wire and preparation method thereof
  • A kind of corrosion-resistant bonding copper wire and preparation method thereof
  • A kind of corrosion-resistant bonding copper wire and preparation method thereof

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preparation example Construction

[0031] A preparation method of corrosion-resistant bonding copper wire, characterized in that: comprising the following steps:

[0032] S1: Material preparation, first purify the copper wire, prepare high-purity copper wire raw materials with a purity greater than 99.9%, and heat and melt it.

[0033] S2: Casting molding, deoxidizing the liquid copper in an atmosphere of hydrogen gas, removing impurities, casting the molten copper into the shape of the copper wire body 1 through a wire drawing machine to form an oxygen-free copper wire, and drawing the bonded copper wire The diameter is 1mm-1.3mm.

[0034] S3: Preliminary processing, the surface of the copper wire is plated with a copper-zinc alloy by a galvanizing machine, and the copper-zinc alloy is plated into the shape of the alloy sheet 6, so that the copper-zinc alloy is in the form of a film, and grooves 2 are provided on the surface of the copper wire body 1, Graphite block 3 is inlaid on the inner wall of groove 2, ...

Embodiment 1

[0038] A corrosion-resistant bonding copper wire and a preparation method thereof include a copper wire body 1, a groove 2 is opened on the surface of the copper wire body 1, a graphite block 3 is fixedly connected to the inner wall of the groove 2, and the graphite block 3 has the shape of a front sectional view It is in the shape of a semicircle, and the shape of the graphite block 3 matches the shape of the groove 2. The side of the graphite block 3 away from the inner wall of the groove 2 is fixedly connected with an alloy block 4, and the surface of the copper wire body 1 is inlaid with an alloy ring 5. The vertical plane where the alloy ring 5 is located is parallel to the vertical plane where the alloy block 4 is located. The surface of the copper wire body 1 is inlaid with an alloy sheet 6, and the alloy sheet 6 is lapped on the surface of the graphite block 3. The number of alloy sheets 6 is four , the four alloy sheets 6 are distributed in a circular array with the ce...

Embodiment 2

[0046] A corrosion-resistant bonding copper wire and a preparation method thereof include a copper wire body 1, a groove 2 is opened on the surface of the copper wire body 1, a graphite block 3 is fixedly connected to the inner wall of the groove 2, and the graphite block 3 has the shape of a front sectional view It is in the shape of a semicircle, and the shape of the graphite block 3 matches the shape of the groove 2. The side of the graphite block 3 away from the inner wall of the groove 2 is fixedly connected with an alloy block 4, and the surface of the copper wire body 1 is inlaid with an alloy ring 5. The vertical plane where the alloy ring 5 is located is parallel to the vertical plane where the alloy block 4 is located. The surface of the copper wire body 1 is inlaid with an alloy sheet 6, and the alloy sheet 6 is lapped on the surface of the graphite block 3. The number of alloy sheets 6 is four , the four alloy sheets 6 are distributed in a circular array with the ce...

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Abstract

The invention discloses an anti-corrosion bonding copper wire and a preparation method thereof and relates to the technical field of bonding copper wires. The anti-corrosion bonding copper wire comprises a copper wire body, grooves are formed in the surface of the copper wire body, the inner walls of the grooves are fixedly connected with graphite blocks, and alloy blocks are fixedly connected with the sides, away from the inner walls of the grooves, of the graphite blocks. Alloy rings are embedded in the surface of the copper wire body, and the vertical planes where the alloy rings are located are parallel to the vertical planes where the alloy blocks are located. Alloy sheets are embedded in the surface of the copper wire body, the alloy sheets are arranged on the surfaces of the graphite blocks in an overlap joint mode, the number of the alloy sheets is four, the number of the grooves is four sets, and each set of grooves is located between the two corresponding adjacent alloy sheets. According to the anti-corrosion bonding copper wire and the preparation method thereof, due to the arrangement of the alloy sheets and the alloy rings, the problems that an existing bonding copperwire is abraded after being used for a long term, consequently a protecting layer falls off, anti-oxidation and anti-acidification performance becomes poor, and the service life of the bonding copperwire is shortened are solved.

Description

technical field [0001] The invention relates to the technical field of bonding copper wire, in particular to a corrosion-resistant bonding copper wire and a preparation method thereof. Background technique [0002] The bonding process of bonding copper wire is mature, and can be widely used in the high-tech industries of integrated circuits and device semiconductors. Bonding copper wire is an inner lead material with excellent electrical, thermal conductivity, mechanical properties and excellent chemical stability. Low, high mechanical properties, suitable for fine wire diameter and pitch bonding wire, mainly used as key packaging materials for semiconductors such as: bonding copper wire, frame, molding compound, solder ball, high-density packaging substrate and conductive adhesive, etc., traditional There are certain defects in the production and processing of high-quality copper wires, such as: poor ball forming, relatively hard ball shape, which is not conducive to copper...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/49
CPCC22C1/03C22C9/00H01L23/49
Inventor 程叙毅张连杰汪传灿
Owner WUHU CHANGRUN SPECIAL COPPER