The invention relates to a
semiconductor package and a method of packaging the same, wherein the method comprises the following steps: setting wafers on a bearing piece;
inert gas passing through the periphery of the line end of the linear part of the
copper welding wire so that the line end is formed into a ball part, wherein the distance between each edge of the ball part and the
central line of the
copper welding wire is basically equal, and the linear part and the ball part respectively have a line
diameter D1 and a
ball diameter D2, and D2 is larger than or equal to 2*D1 and is smaller than or equal to 2.5*D1; bonding the ball part to the pad of the
wafer, wherein the ball part is formed into arc bonding part after bonding, the distance between each edge of the arc bonding part and the
central line of the
copper welding wire is basically equal, the linear part after bonding has a cross section
diameter D1', the arc bonding part has a cross section
diameter D2', and D2' is larger than or equal to 1.8*D1' and is smaller than or equal to 3*D1'; and
coating the
wafer and the copper welding wire and covering the bearing piece so that a sealing compound, the
wafer and the bearing piece form the
package. In the electric burning process of the ball part of the copper welding wire in the method of packaging the
semiconductor, the
inert gas can efficiently prevent
oxygen gas from being contacted with copper, thus copper is not easy to oxidize even at high electric burning temperature; therefore, the invention has the benefit that the ball part is in the shape of a ball successfully.