8 results about "Strontium fluoride" patented technology

The invention relates to the technical field of drying machines, and discloses a strontium fluoride drying machine and a preparation method thereof.The strontium fluoride drying machine comprises a drying cylinder and a bottom plate, a left end cover and a right end cover are fixedly installed at the top end of the bottom plate, and the drying cylinder is rotatably installed between the left end cover and the right end cover; the plurality of shifting plates are uniformly and fixedly mounted on the inner wall of the drying cylinder in the circumferential direction, and are used for shifting strontium fluoride particles through the plurality of shifting plates when the drying cylinder rotates; and the screening plate is mounted in the drying cylinder and is used for screening the strontium fluoride particles. When a screening plate moves, a second spring rod drives a transmission rack to synchronously move, so that the transmission rack can drive a crushing roller to rotate through a transmission gear meshed with the transmission rack, and the crushing roller and crushing teeth mounted on the inner wall of a receiving hopper are matched to perform crushing treatment on caked strontium fluoride particles; and the drying uniformity of the strontium fluoride particles is ensured.

This application provides a toothpaste with antibacterial, anti-cavity, and teeth-strengthening effects, and its preparation method, relating to the field of daily chemical products technology. The toothpaste provided by this invention includes an antibacterial repair agent, which, by weight, comprises: 5-15 parts β-glucan, 2-8 parts mannoerythritol ester, and 2-8 parts Hedychium spirica extract. This invention combines β-glucan, mannoerythritol ester, and Hedychium spirica extract in a combination added to the toothpaste, which can reduce the amount of strontium fluoride and / or sodium fluoride, bioactive glass, etc., effectively achieving long-lasting protection and strengthening teeth.

The invention discloses a low-dielectric-loss chip packaging glass substrate and a preparation method thereof, and relates to the technical field of glass manufacturing. The chip packaging glass substrate is prepared from the following raw materials: silicon dioxide, boric oxide, zirconium dioxide, germanium dioxide, aluminum oxide, gadolinium oxide, a composite fluxing component and a low-loss dielectric functional component, the composite fluxing component is prepared from the following raw materials: magnesium fluoride, lithium metaborate and strontium fluoride; the low-loss dielectric functional component is prepared from the following raw materials: silicon nitride, boron nitride micro powder and a coupling agent solution. The preparation method of the chip packaging glass substrate comprises the following steps: preparing the composite fluxing component, preparing the low-loss dielectric functional component, forming the glass substrate, and preparing the chip packaging glass substrate. The prepared chip packaging glass substrate is low in dielectric loss and excellent in mechanical property.

This invention relates to a transparent strontium fluoride ceramic based on low-temperature sintering, its preparation method, and its applications. The transparent strontium fluoride ceramic, by mass percentage, consists of 95-99% strontium fluoride matrix and 1%-5% thermosensitive luminescent material. The method of this invention uses a mild strontium acetate solution as a sintering aid, and successfully prepares a transparent strontium fluoride ceramic with a density greater than 99% and high optical transmittance under a low temperature of 100-150 °C and a uniaxial pressure of 300-400 MPa. The low-temperature sintering process of this invention avoids damage to the material from strong acids and alkalis, allows the thermosensitive luminescent material to be incorporated into the ceramic matrix during sintering, effectively preserving the excellent properties of the luminescent material and exhibiting excellent optical performance and encapsulation protection.

The utility model discloses a novel film-coated cover plate with an electromagnetic shielding function and a vehicle-mounted liquid crystal display screen, the cover plate comprises a glass substrate, and a silicon dioxide layer, a titanium dioxide layer, a strontium fluoride layer and a nanometer copper wire grid layer which are sequentially stacked on the upper surface of the glass substrate from bottom to top, the thickness of the silicon dioxide layer is 50nm-100nm, and the thickness of the titanium dioxide layer is 50nm-100nm. The thickness of the titanium dioxide layer ranges from 100 nm to 200 nm, the thickness of the strontium fluoride layer ranges from 50 nm to 100 nm, and the thickness of the nanometer copper wire grid layer ranges from 20 nm to 40 nm. The optimization of the performance of the coating layers of the cover plate is realized by accurately controlling the material selection and thickness distribution of each coating layer. By means of the layered structure design, comprehensive upgrading of the cover plate coating layer in the aspects of optical performance, physical protection and electromagnetic shielding is achieved, and powerful technical support is provided for development of electronic display equipment. The light transmittance, ultraviolet resistance and electromagnetic shielding capability of the cover plate are improved, so that the user experience is improved, the service life of equipment is prolonged, and the competitiveness of a product is improved.

The utility model discloses a coated cover plate and a liquid crystal display capable of improving scratch resistance and corrosion resistance, the cover plate comprises a glass substrate, and a magnesium fluoride layer, a titanium dioxide layer, a strontium fluoride layer and a titanium carbide layer which are sequentially stacked on the upper surface of the glass substrate from bottom to top, the thickness of the magnesium fluoride layer is 50nm-100nm, the thickness of the titanium dioxide layer is 50nm-100nm, and the thickness of the strontium fluoride layer is 50nm-100nm. The thickness of the titanium dioxide layer ranges from 100 nm to 200 nm, the thickness of the strontium fluoride layer ranges from 50 nm to 100 nm, and the thickness of the titanium carbide layer ranges from 40 nm to 60 nm. The magnesium fluoride layer is used as a bottom layer, reflection of light on a glass interface is effectively reduced by utilizing the characteristic of low refractive index, and the light transmittance is improved; the titanium dioxide layer is used as a middle layer, so that the light transmission is enhanced, the coating layer is endowed with ultraviolet resistance, and internal components are protected; the strontium fluoride layer is used as a functional layer to further reduce the refractive index and optimize the optical performance; and the titanium carbide layer is used as the top layer, so that solid physical protection is provided for the glass substrate due to excellent hardness and wear resistance of the titanium carbide layer.

The application discloses a kind of low dielectric loss chip packaging glass substrate and preparation method thereof, it is related to glass manufacturing technical field.The raw material composition of chip packaging glass substrate is: silicon dioxide, boron oxide, zirconium dioxide, germanium dioxide, aluminum oxide, gadolinium oxide, composite fluxing component, low-loss dielectric functional component;Composite fluxing component: raw material includes magnesium fluoride, lithium metaborate, strontium fluoride;Low-loss dielectric functional component: raw material includes silicon nitride, boron nitride micro powder, coupling agent solution.The preparation method of chip packaging glass substrate includes preparing composite fluxing component, preparing low-loss dielectric functional component, glass matrix forming, and the steps of obtaining chip packaging glass substrate.The chip packaging glass substrate prepared by the application has low dielectric loss and excellent mechanical properties.

The invention discloses a continuous preparation method of an acyl fluoride compound, according to the continuous preparation method, in the presence of a catalyst, perfluoroolefin with a general formula of R1R2C = CR3R4 and carbonyl fluoride are subjected to an addition reaction to prepare the acyl fluoride compound with a general formula of CFR3R4-CR1R2-COF, R1, R2, R3 and R4 are independently selected from CnF2n + 1, and n is 0-6; the catalyst is a non-loaded body porous catalyst and consists of bicarbonate and hydrofluoride, and the bicarbonate is selected from one or more of lithium bicarbonate, sodium bicarbonate, potassium bicarbonate, cesium bicarbonate, magnesium bicarbonate, calcium bicarbonate, strontium bicarbonate and barium bicarbonate; the hydrogen fluoride salt is selected from one or more of lithium fluoride, sodium fluoride, potassium fluoride, cesium fluoride, magnesium fluoride, calcium fluoride, strontium fluoride and barium fluoride; the mass percentage ratio of the bicarbonate to the hydrofluoride is (0-60%): (40-100%). The method is mild in continuous reaction condition, easy to operate, almost free of byproducts and suitable for continuous production.