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Preparation method of flexible sensor

A flexible sensor and strain sensing technology, applied in instruments, measuring devices, electric/magnetic solid deformation measurement, etc., to reduce the impact of measurement, save space, and improve preparation efficiency.

Active Publication Date: 2018-12-21
TSINGHUA UNIV
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  • Abstract
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Problems solved by technology

This poses a challenge for the fabrication of flexible electronic devices

Method used

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  • Preparation method of flexible sensor
  • Preparation method of flexible sensor
  • Preparation method of flexible sensor

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Embodiment Construction

[0040] Various exemplary embodiments, features, and aspects of the present disclosure will be described in detail below with reference to the drawings. The same reference signs in the drawings indicate elements with the same or similar functions. Although various aspects of the embodiments are shown in the drawings, unless otherwise noted, the drawings are not necessarily drawn to scale.

[0041] The dedicated word "exemplary" here means "serving as an example, embodiment, or illustration." Any embodiment described herein as "exemplary" need not be construed as being superior or better than other embodiments.

[0042] In addition, in order to better illustrate the present disclosure, numerous specific details are given in the following specific embodiments. Those skilled in the art should understand that without certain specific details, the present disclosure can also be implemented. In some instances, the methods, means, elements, and circuits well-known to those skilled in th...

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Abstract

The invention relates to a preparation method of a flexible sensor. The preparation method comprises the steps of sequentially generating a sacrificial layer and a substrate layer on a base; sputtering a metal layer on the substrate layer; performing first photo-etching and etching processing on the metal layer to form a strain sensor device; coating a photosensitive layer on the strain sensor device and the substrate layer; performing second photo-etching and etching processing on the photosensitive layer to form an optical waveguide; integrating a light source and a photoelectric detector ata position, corresponding to the optical waveguide, on the substrate layer so that the light source, the photoelectric detector and the optical waveguide form the optical sensor device; packaging thesubstrate layer, the strain sensor device and the optical sensor device by use of a packaging layer so that the substrate layer, the strain sensor device, the optical sensor device and the packaginglayer form the flexible sensor; and dissolving the sacrificial layer so that the flexible sensor and the base are separated. According to the reparation method of the flexible sensor, the strain sensor device and the optical sensor device with complicated double-layer structures are molded once through large-range photo-etching, and the preparation efficiency of the flexible sensor is improved.

Description

Technical field [0001] The present disclosure relates to the field of semiconductor technology, and in particular to a method for preparing a flexible sensor. Background technique [0002] Sensors in flexible electronic devices involve various sensing principles such as mechanics, electricity, magnetism, optics, biology, chemistry, etc., and have a wide range of applications in the fields of medicine and health. With the development of science and technology, flexible electronic sensing equipment is developing towards multi-function and compactness. This requires the integration of as many sensors as possible on the electronic sensing equipment, while ensuring that the flexible electronic equipment is as small as possible And compact. This poses a challenge to the preparation of flexible electronic devices. Summary of the invention [0003] In view of this, the present disclosure proposes a method for preparing a flexible sensor. [0004] According to an aspect of the present dis...

Claims

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Application Information

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IPC IPC(8): G01B7/16G01B11/16
Inventor 冯雪刘鑫陈毅豪
Owner TSINGHUA UNIV
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