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Flexible touch panel and preparation method thereof

A flexible touch and flexible substrate technology, which is applied in the fields of instruments, computing, and electrical digital data processing, etc., can solve the problems affecting the use of flexible touch panels, reduced flexibility, poor adhesion, etc.

Active Publication Date: 2021-11-05
WGTECH JIANGXI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The flexible touch panel prepared by the above method needs to be doped with a hardener in the nano-silver coating to achieve the attachment of the nano-silver on the surface of the flexible substrate. However, when the flexible touch panel prepared by the above-mentioned method is bent repeatedly, the nano-silver coating The hardener in the touch layer will cause cracks, lower hardness, lower flexibility and poor adhesion of the touch layer, which will further lead to an increase in resistivity, thus affecting the use of flexible touch panels

Method used

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  • Flexible touch panel and preparation method thereof

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preparation example Construction

[0034] see figure 1 , the preparation method of the flexible touch panel of an embodiment, comprises the following steps:

[0035] S110. Acquire a flexible substrate.

[0036] In one embodiment, the material of the flexible substrate is selected from at least one of polyethylene terephthalate (PET) and polyimide (PI).

[0037] In one embodiment, the thickness of the flexible substrate is 0.01mm˜0.5mm. Further, the thickness of the flexible substrate may also be 0.05mm, 0.1mm or 0.25mm.

[0038] Wherein, the flexible substrate has a first surface and a second surface opposite to the first surface.

[0039] S120, cleaning the flexible substrate.

[0040] In one embodiment, when cleaning the flexible substrate, the flexible substrate is firstly scrubbed, and then the scrubbed flexible substrate is sequentially put into water and alcohol for ultrasonic cleaning. Further, water is deionized water.

[0041] In one embodiment, after the flexible substrate is ultrasonically clea...

Embodiment 1

[0094] The flexible touch panel of this embodiment is prepared by the following method:

[0095] (1) Obtain a flexible substrate with a thickness of 0.1 mm. The flexible substrate is a polyethylene terephthalate substrate. The substrate is dried in alcohol vapor.

[0096] (2) Roughen the first surface of the flexible substrate by reactive ion etching until the roughness of the first surface is 30.1nm, and the power of reactive ion etching is 60W for roughening. in CF 4 and O 2 Under the mixed gas atmosphere, CF 4 The gas flow rate is 250sccm, O 2 The gas flow rate is 200 sccm, and the roughening treatment time is 3 minutes.

[0097] (3) The first silicon dioxide layer is formed by sputtering on the first surface by magnetron sputtering, the power of magnetron sputtering is 750W, the rate of magnetron sputtering is 25nm / min, and the flow rate of oxygen is 10sccm , the flow rate of argon gas is 600 sccm, the target base distance of magnetron sputtering is 8 cm, and the thi...

Embodiment 2

[0103] The flexible touch panel of this embodiment is prepared by the following method:

[0104] (1) Obtain a flexible substrate with a thickness of 0.1 mm. The flexible substrate is a polyethylene terephthalate substrate. The substrate is dried in alcohol vapor.

[0105] (2) The first surface of the flexible substrate is roughened by reactive ion etching until the roughness of the first surface is 33nm. The power of reactive ion etching is 75W when roughening. in CF 4 and O 2 Under the mixed gas atmosphere, CF 4 The gas flow rate is 300sccm, O 2 The gas flow rate is 100 sccm, and the roughening treatment time is 3 minutes.

[0106] (3) The first silicon dioxide layer is formed by sputtering on the first surface by magnetron sputtering, the power of magnetron sputtering is 1000W, the rate of magnetron sputtering is 25nm / min, and the flow rate of oxygen is 15sccm , the flow rate of argon gas is 800 sccm, the target base distance of magnetron sputtering is 8 cm, and the th...

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Abstract

The present invention relates to a flexible touch panel and a preparation method thereof. A preparation method of a flexible touch panel includes the following steps: obtaining a flexible substrate, the flexible substrate having a first surface and a second surface opposite to the first surface; roughening the first surface; A first silicon dioxide layer is formed by sputtering on the roughened first surface; a silver layer is formed by sputtering on the side of the first silicon dioxide layer away from the first surface; and the silver layer is formed by sputtering A yellow light process is performed to form a touch electrode layer. The flexible touch panel prepared by the above-mentioned preparation method of the flexible touch panel has good bending resistance, the touch electrode layer still has good hardness, flexibility and adhesion after repeated bending, and the above flexible touch panel The resistance change rate is small when bending.

Description

technical field [0001] The invention relates to the field of touch technology, in particular to a flexible touch panel and a preparation method thereof. Background technique [0002] Compared with LCD screens, flexible organic screens are not only lighter and thinner in size, but also lower in power consumption, which helps to improve the battery life of the device. At the same time, because OLEDs are bendable and flexible, their durability is also greater than that of LCD screens. In the past, the screen reduces the probability of accidental damage to the equipment. After Samsung and LG launch the first batch of curved-screen mobile phones, more terminal manufacturers will follow up in this market. Curved screens are the first step in progressive screen technology. In the next few years, flexible screens, bendable screens, foldable screens, and rollable screens will all be on the scene. It is estimated that within 3 to 5 years, flexible OLED screens are expected to be app...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F3/041
CPCG06F3/0412G06F2203/04102G06F2203/04103
Inventor 张迅周慧蓉张伯伦易伟华
Owner WGTECH JIANGXI
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