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38results about How to "Small resistance change rate" patented technology

Transparent conductive film and preparation method thereof

The invention relates to a transparent conductive film and a preparation method thereof, and belongs to the technical field of preparation of conductive films. With copper chloride as a copper source,oleic acid and oleylamine as inducers, glucose as a reducing agent and polyvinylpyrrolidone as a stabilizer, copper nanowires with high length-diameter ratio, uniform diameter, good dispersibility and regular morphology are prepared; through formation of a network with smaller linear density, a longer penetration path is provided, internal copper wire nodes are reduced, the resistivity is reduced, and a transparent metal film with low haze, high transparency, high conductivity and excellent mechanical flexibility and strength is achieved; then the copper nanowires are covered with an aqueouspoly(3,4-ethylenedioxythiophene)-polystyrene sulfonic acid solution to prepare a composite film to improve the oxidation resistance of the copper nanowires, so that the energy absorbing ability of themetal film layer during folding deformation is enhanced, the slippage degree of conductive particles is reduced, and thus the resistance change rate of a coating layer is reduced and the flexibilityand the electrical stability of a product are further improved.
Owner:常州市丰瑞电子有限公司

Solvent-free conductive silver adhesive with stable contact resistance

The invention discloses a solvent-free conductive silver adhesive with a stable contact resistance, which relates to a conductive binding agent. The solvent-free conductive silver adhesive is a single-component conductive adhesive which is prepared by taking silver powder as a main body through adding organic carrier accessories into the main body; in the conductive adhesive, the mass percent of the main body (silver powder) is 70-75%, the mass percent of the organic carrier accessories is 25-30%, and the mass percent of a curing agent is 0.1-0.5%; the silver powder refers to flaked silver powder or branched silver powder; the organic carrier is composed of two types of epoxy resins and a kind of thermosetting phenolic resins, wherein the mass percent of the epoxy resins is 80-90%, and the mass percent of the thermosetting phenolic resins is 10-20%; and the curing agent refers to an imidazole type polymer or amine curing agent. The solvent-free conductive silver adhesive disclosed by the invention has the advantages that no organic solvent is added, the heating temperature of the conductive silver adhesive is less than that of a conductive adhesive prepared in the prior art, and the time consumption for curing is reduced; a heated / cured product is compact in structure and uneasy to have electrochemical corrosion, and the moisture absorption is reduced; and the solvent-free conductive silver adhesive has high contact resistance stability and good conductivity.
Owner:贵州振华亚太高新电子材料有限公司

High-resistance carbon film circuit board and manufacturing method therefor

The invention provides a manufacturing method for a high-resistance carbon film circuit board. The manufacturing method comprises the following steps of a, designing a silk screen pattern and manufacturing a silk screen; b, printing conductive metal paste on a PCB through silk screen printing by means of frictioning, and performing drying to form a conductive metal circuit; c, printing high-resistance ink on the conductive metal circuit through silk screen printing by means of frictioning, and performing drying to form a first high-resistance carbon film, wherein the first high-resistance carbon film is 7-9[mu]m in thickness; and d, paving the silk screen on the first high-resistance carbon film, printing the high-resistance ink on the first high-resistance carbon film through silk screen printing by means of frictioning, and performing drying to form a second high-resistance carbon film, wherein the second high-resistance carbon film is 7-9[mu]m in thickness. According to the manufacturing method, the original one-time printing and shaping process is divided into two times of printing, so that carbon distribution can be more uniform and resistance change rate of the formed product can be lowered; and the high-resistance carbon film is high in stability, so that the yield of the product can be effectively improved.
Owner:东莞福哥电子有限公司

Low-temperature-coefficient metal film resistor and manufacturing process thereof

The invention discloses a low-temperature-coefficient metal film resistor. A resistor body comprises a base body, a metal film wrapping the outer side of the base body, a first electrode cap and a second motor cap, the first electrode cap and the second motor cap are connected to the front end and the rear end of the metal film, and the outer portion of the resistor body is coated with a paint layer; the rear end of the second motor cap is connected to the epoxy resin block through a protective tube, a T-shaped fixing plug inserted into the protective tube is arranged in the second motor cap,a limiting plug is inserted into the rear end of the interior of the protective tube, and the rear end of the pin penetrates through the T-shaped fixing plug, the protective tube and the limiting plugin sequence; the rear end of the limiting plug is inserted into a positioning hole in the epoxy resin block, and a fixing ring on the outer side of the rear end of the protection pipe is fixed to a groove in the front portion of the positioning hole through a screw. According to the invention, the protection effect on the pins is improved, so that the structure is firmer; the protection tube is firmly connected with the epoxy resin block, so that the pins are effectively protected; and heat generated when the resistor body works can be dissipated quickly.
Owner:安徽怡娅通科技有限公司

A low-temperature fast-curing organic resin carrier for printed electronics and its preparation method and application

The invention discloses a low-temperature fast curing setting organic resin carrier for printing electronics and a preparation method and application thereof. The method comprises the steps that curing can be completed at the temperature of 120-150 DEG C for 1-9 min, the room temperature storage stability is good, continuous printing can be achieved, a curing film layer has the good electrical conductivity, solvent resistance, adhesive force, surface hardness and other comprehensive performances, the braking curing time is prolonged, and the resistance changing rate is smaller than 5%. Compared with the application performance of traditional printing electronic paste, damage caused by thermal treatment to organic materials and preparation devices is effectively lowered, the production yield is improved, the prepared rare and precious metal electronic paste is stably attached to various elastic substrate materials which are high surface energy and hard to adhere, high in reliability and suitable for a large-scale continuous production technology, and the production energy consumption cost is greatly lowered. The organic resin carrier is prepared from, by mass, 30-40% of organic resin, 45-59% of mixed solvents, 8-12% of curing agents and 3-5% of rapid curing accelerators.
Owner:KUNMING INST OF PRECIOUS METALS
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