Solvent-free conductive silver adhesive with stable contact resistance

A technology of conductive silver glue and contact resistance, applied in the direction of adhesive types, conductive adhesives, adhesives, etc., can solve problems such as unstable contact resistance, achieve reduced curing time, reduced electrochemical corrosion, and good electrical conductivity Effect

Inactive Publication Date: 2012-01-25
贵州振华亚太高新电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a solvent-free conductive silver glue with stable contact resistance, to overcome the shortcoming of the unstable contact resistance of the product after the existing conductive glue is cured

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] Example 1: Prepare 100 kg of solvent-free conductive silver glue with stable contact resistance, the quality of the raw materials used is as follows:

[0013] Flake silver powder 74.9kg

[0014] T85 epoxy resin 15kg

[0015] CER170 epoxy resin 8kg

[0016] 2173 phenolic resin 2kg

[0017] 1202 curing agent 0.1kg,

[0018] The above-mentioned epoxy resin and phenolic resin are uniformly mixed at room temperature, and then the above-mentioned components are uniformly rolled, and the finished product is obtained after the test technical indicators are qualified.

Embodiment 2

[0019] Example 2: Prepare 100kg of solvent-free conductive silver paste with stable contact resistance, and the mass parts of raw materials used are as follows

[0020] Dendritic silver powder 70kg

[0021] T85 epoxy resin 18kg

[0022] CER170 epoxy resin 9kg

[0023] MT-1 phenolic resin 2.5kg

[0024] Dicyandiamine curing agent 0.5kg

[0025] The above-mentioned epoxy resin and phenolic resin are uniformly mixed at room temperature, and then the above-mentioned components are uniformly rolled, and after the test technical indicators are qualified, the finished product is obtained.

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PUM

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Abstract

The invention discloses a solvent-free conductive silver adhesive with a stable contact resistance, which relates to a conductive binding agent. The solvent-free conductive silver adhesive is a single-component conductive adhesive which is prepared by taking silver powder as a main body through adding organic carrier accessories into the main body; in the conductive adhesive, the mass percent of the main body (silver powder) is 70-75%, the mass percent of the organic carrier accessories is 25-30%, and the mass percent of a curing agent is 0.1-0.5%; the silver powder refers to flaked silver powder or branched silver powder; the organic carrier is composed of two types of epoxy resins and a kind of thermosetting phenolic resins, wherein the mass percent of the epoxy resins is 80-90%, and the mass percent of the thermosetting phenolic resins is 10-20%; and the curing agent refers to an imidazole type polymer or amine curing agent. The solvent-free conductive silver adhesive disclosed by the invention has the advantages that no organic solvent is added, the heating temperature of the conductive silver adhesive is less than that of a conductive adhesive prepared in the prior art, and the time consumption for curing is reduced; a heated / cured product is compact in structure and uneasy to have electrochemical corrosion, and the moisture absorption is reduced; and the solvent-free conductive silver adhesive has high contact resistance stability and good conductivity.

Description

Technical field [0001] The present invention relates to conductive adhesives, in particular, to conductive silver glue. Background technique [0002] With the requirements of light, thin, small, integrated and low cost in the microelectronics industry, the importance of conductive adhesive as a substitute for lead-tin solder as the core basic material of the microelectronics industry has become increasingly prominent. In recent years, new types of conductive adhesives have been published in China, but most of them contain organic solvents, so the shortcoming of unstable contact resistance is very prominent. For example, China Patent No. ZL200610051244.8 "Single-component silver-filled conductive adhesive that can be stored and transported at room temperature", No. ZL200710037520.X "A kind of epoxy conductive silver adhesive for LED and its manufacturing method", No. 200910021736.6 "A packaged LED Conductive silver glue and its preparation method", No. 200910110326.9 "A conductiv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J161/06C09J11/04C09J9/02
Inventor 张力平陈群星吴丹菁张洪英
Owner 贵州振华亚太高新电子材料有限公司
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