Solvent-free conductive silver adhesive with stable contact resistance

Abstract

The invention discloses a solvent-free conductive silver adhesive with a stable contact resistance, which relates to a conductive binding agent. The solvent-free conductive silver adhesive is a single-component conductive adhesive which is prepared by taking silver powder as a main body through adding organic carrier accessories into the main body; in the conductive adhesive, the mass percent of the main body (silver powder) is 70-75%, the mass percent of the organic carrier accessories is 25-30%, and the mass percent of a curing agent is 0.1-0.5%; the silver powder refers to flaked silver powder or branched silver powder; the organic carrier is composed of two types of epoxy resins and a kind of thermosetting phenolic resins, wherein the mass percent of the epoxy resins is 80-90%, and the mass percent of the thermosetting phenolic resins is 10-20%; and the curing agent refers to an imidazole type polymer or amine curing agent. The solvent-free conductive silver adhesive disclosed by the invention has the advantages that no organic solvent is added, the heating temperature of the conductive silver adhesive is less than that of a conductive adhesive prepared in the prior art, and the time consumption for curing is reduced; a heated / cured product is compact in structure and uneasy to have electrochemical corrosion, and the moisture absorption is reduced; and the solvent-free conductive silver adhesive has high contact resistance stability and good conductivity.

Description

Technical field [0001] The present invention relates to conductive adhesives, in particular, to conductive silver glue. Background technique [0002] With the requirements of light, thin, small, integrated and low cost in the microelectronics industry, the importance of conductive adhesive as a substitute for lead-tin solder as the core basic material of the microelectronics industry has become increasingly prominent. In recent years, new types of conductive adhesives have been published in China, but most of them contain organic solvents, so the shortcoming of unstable contact resistance is very prominent. For example, China Patent No. ZL200610051244.8 "Single-component silver-filled conductive adhesive that can be stored and transported at room temperature", No. ZL200710037520.X "A kind of epoxy conductive silver adhesive for LED and its manufacturing method", No. 200910021736.6 "A packaged LED Conductive silver glue and its preparation method", No. 200910110326.9 "A conductiv...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a solvent-free conductive silver glue with stable contact resistance, to overcome the shortcoming of the unstable contact resistance of the product after the existing conductive glue is cured