A kind of electronic silver paste and its preparation process
A preparation process and technology of silver paste, applied in cable/conductor manufacturing, circuits, electrical components, etc., can solve the problems of unfavorable electrical and mechanical properties of silicon substrates of crystalline silicon solar cells, and achieve increased light conversion efficiency and peeling mechanical strength. Raise, increase the effect of touch points and tunneling
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0030] An electronic silver paste and its preparation process. The electronic silver paste is prepared by combining silver powder, glass powder synthesized through technological processing, an organic carrier and additives. A dispersant is added during the combination preparation process; the weight percentage of the above components is as follows :
[0031] Silver powder 65%, glass powder 9%, organic vehicle 24%, additive 1%, dispersant 1%;
[0032] The particles of the silver powder are below 2 μm, and the shape is not limited;
[0033] Described glass powder is boron-bismuth-silicon-aluminum-tin-niobium-titanosilicate system, by B 2 o 3 、 Bi 2 o 3 , SiO 2 、Al 2 o 3 , SnO 2 , Nb 2 o 5 、TiO 2 The raw materials are processed and synthesized, and the weight percentages of each component are as follows:
[0034] B 2 o 3 2%, Bi 2 o 3 30%, SiO 2 19%, Al 2 o 3 2%, SnO 2 25%, Nb 2 o 5 14%, TiO 2 8%;
[0035] The organic carrier is a viscous liquid formed...
Embodiment 2
[0048] An electronic silver paste and its preparation process. The electronic silver paste is prepared by combining silver powder, glass powder synthesized through technological processing, an organic carrier and additives. A dispersant is added during the combination preparation process; the weight percentage of the above components is as follows :
[0049] Silver powder 63%, glass powder 6%, organic vehicle 28%, additive 2%, dispersant 1%;
[0050] The particles of the silver powder are below 2 μm, and the shape is not limited;
[0051] Described glass powder is boron-bismuth-silicon-aluminum-tin-niobium-titanosilicate system, by B 2 o 3 、 Bi 2 o 3 , SiO 2 、Al 2 o 3 , SnO 2 , Nb 2 o 5 、TiO 2 The raw materials are processed and synthesized, and the weight percentages of each component are as follows:
[0052] B 2 o 3 14%, Bi 2 o 3 25%, SiO 2 20%, Al 2 o 3 7%, SnO 2 20%, Nb 2 o 5 7%, TiO 2 7%;
[0053] The organic carrier is a viscous liquid form...
Embodiment 3
[0066] An electronic silver paste and its preparation process. The electronic silver paste is prepared by combining silver powder, glass powder synthesized through technological processing, an organic carrier and additives. A dispersant is added during the combination preparation process; the weight percentage of the above components is as follows :
[0067] Silver powder 80%, glass powder 5%, organic vehicle 12%, additive 1%, dispersant 2%;
[0068] The particles of the silver powder are below 2 μm, and the shape is not limited;
[0069] Described glass powder is boron-bismuth-silicon-aluminum-tin-niobium-titanosilicate system, by B 2 o 3 、 Bi 2 o 3 , SiO 2 、Al 2 o 3 , SnO 2 , Nb 2 o 5 、TiO 2The raw materials are processed and synthesized, and the weight percentages of each component are as follows:
[0070] B 2 o 3 22%, Bi 2 o 3 26%, SiO 2 10%, Al 2 o 3 12%, SnO 2 18%, Nb 2 o 5 10%, TiO 2 2%;
[0071] The organic vehicle is a viscous liquid for...
PUM
Property | Measurement | Unit |
---|---|---|
viscosity | aaaaa | aaaaa |
particle size | aaaaa | aaaaa |
softening point | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com