A low-temperature fast-curing organic resin carrier for printed electronics and its preparation method and application

An organic resin and rapid curing technology, which is applied in the field of information electronic material preparation, can solve problems such as dependence, and achieve the effects of improving compatibility, good reproducibility, and prolonging the rate of change in resistance

Active Publication Date: 2018-12-07
KUNMING INST OF PRECIOUS METALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional conductive paste can no longer meet the requirements of technological development, and the realization of these application goals depends on the development and application of new technologies

Method used

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  • A low-temperature fast-curing organic resin carrier for printed electronics and its preparation method and application
  • A low-temperature fast-curing organic resin carrier for printed electronics and its preparation method and application
  • A low-temperature fast-curing organic resin carrier for printed electronics and its preparation method and application

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preparation example Construction

[0028] The method for preparing a low-temperature fast-curing organic resin carrier for printed electronics in an embodiment of the present invention includes the following steps:

[0029] (1) First add the solvent into the barrel in proportion, then add the organic resin into the barrel in proportion under low-speed stirring, increase the stirring speed of the disperser, and keep the system temperature within 80°C. After the organic resin is completely dissolved, cool the resin liquid to At room temperature, then add the curing agent and fast curing accelerator in proportion and stir evenly, and the low-temperature fast-curing organic resin carrier for printed electronics can be used;

[0030] (2) For the electronic slurry system that needs to be ground for a long time, the fast curing accelerator is added after the plan is adopted. The filler powder and the organic resin carrier in step (1) are pre-ground to fineness by three rolls, and then the fast curing accelerator is add...

Embodiment 1

[0033] (1-1) The mass percentage of the organic resin carrier is as follows: 35% of the modified polyester resin with a molecular weight of 17000, 49% of the mixed solvent: diethyl adipate / DBE (V:V=1:2), 12 % blocked isocyanate curing agent: NCO content 6.4wt%, unblocking temperature 95°C, 4% fast curing accelerator: titanate chelate / DBU (Wt:Wt=4.5:0.5). First add the solvent into the barrel in proportion, then add the organic resin into the barrel in proportion under low-speed stirring, increase the stirring speed of the disperser, keep the system temperature within 80°C, wait until the organic resin is completely dissolved, cool the resin solution to room temperature, and then Add the curing agent in proportion and stir evenly for use; the rapid curing accelerator is separately in proportion for use.

[0034] (1-2) Weigh raw materials according to the following mass percentage: 70% average particle size 1.0 μm, bulk density 2.4g / cm 3 , The tap density is 4.0g / cm 3 , Dmax≤2...

Embodiment 2

[0036] (2-1) The mass percentage of the organic resin carrier is as follows: 40% of the molecular weight 15000 modified polyester resin, 45% of the mixed solvent: DBE / isophorone (V:V=8:1), 10% of the Blocked isocyanate curing agent: NCO content 12.5wt%, unblocking temperature 120°C, 5% fast curing accelerator: titanate chelate / DMAP (Wt:Wt=4.7:0.3). First add the solvent into the barrel in proportion, then add the organic resin into the barrel in proportion under low-speed stirring, increase the stirring speed of the disperser, keep the system temperature within 80°C, wait until the organic resin is completely dissolved, cool the resin solution to room temperature, and then Add curing agent and fast curing accelerator in proportion and stir evenly for use.

[0037] (2-2) Weigh raw materials according to the following mass percentage: 67% average particle size 8.0 μm, bulk density 0.8g / cm 3 , The tap density is 1.7g / cm 3 , Silver-coated copper powder with a silver content of 3...

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Abstract

The invention discloses a low-temperature fast curing setting organic resin carrier for printing electronics and a preparation method and application thereof. The method comprises the steps that curing can be completed at the temperature of 120-150 DEG C for 1-9 min, the room temperature storage stability is good, continuous printing can be achieved, a curing film layer has the good electrical conductivity, solvent resistance, adhesive force, surface hardness and other comprehensive performances, the braking curing time is prolonged, and the resistance changing rate is smaller than 5%. Compared with the application performance of traditional printing electronic paste, damage caused by thermal treatment to organic materials and preparation devices is effectively lowered, the production yield is improved, the prepared rare and precious metal electronic paste is stably attached to various elastic substrate materials which are high surface energy and hard to adhere, high in reliability and suitable for a large-scale continuous production technology, and the production energy consumption cost is greatly lowered. The organic resin carrier is prepared from, by mass, 30-40% of organic resin, 45-59% of mixed solvents, 8-12% of curing agents and 3-5% of rapid curing accelerators.

Description

technical field [0001] The invention belongs to the technical field of preparation of information electronic materials, and more specifically relates to a low-temperature fast-curing organic resin carrier for printed electronics and its preparation method and application. Background technique [0002] The preparation and integration of electronic pastes for optoelectronic devices is an effective means to realize low-cost manufacturing of information electronic devices and realize wide-scale and commercial applications, and is one of the important directions for the future development of information electronic devices. The technical development of electronic paste has promoted the research and application of various electronic devices manufactured by traditional printing technology. Due to the low cost of printing, such products are mainly consumer electronics products. With the development of electronics, photovoltaics and other industries towards miniaturization, portabilit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L67/00C08K5/10C08K7/18C08K3/08C08K9/10C08K7/00
CPCC08K3/08C08K5/10C08K7/00C08K7/18C08K9/10C08K2003/0806C08K2003/085C08L67/00
Inventor 李俊鹏陈家林李文琳周利民李世鸿
Owner KUNMING INST OF PRECIOUS METALS
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